Device Packaging

Advanced Glass Substrates Event

Meet us at IMAPS Device Packaging 2027 in Phoenix – a leading conference focused on advances in semiconduc­tor packaging, bringing together industry professionals and technology experts to discuss emerging solutions and developments in microelectronics packaging. PLANOPTIK will be showcasing its glass wafers and glass panels for advanced packaging and wafer-level packaging (WLP). Our glass substrates offer promising possibilities for next-generation packaging concepts, supporting the evolving requirements of semiconductor integration and advanced device manufacturing. We look forward to connecting with industry experts in Phoenix, exchanging ideas and discussing how our glass solutions can contribute to your packaging projects!

Showcase products
> Glass Core Substrates for Advanced Packaging
> Wafers for Wafer-Level Packaging