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Wafer-Level Packaging
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Device Packaging
Advanced Glass Substrates Event
Your Content Goes Here Conference Meet us at IMAPS Device Packaging 2027 in Phoenix – a leading conference focused on advances in semiconductor packaging, bringing together industry professionals and technology experts to discuss emerging solutions and developments in microelectronics packaging. PLANOPTIK will be showcasing its […]
Semicon Japan
Advanced Substrates & Semiconductor Solutions Event
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Exhibition
Join us at SEMICON Japan, one of the leading events for the semiconductor industry, bringing together the latest innovations in semiconductor manufacturing, equipment, materials, and technologies. We are looking forward to showcasing our high-quality glass wafers and […]
Semicon Europa
Advanced Substrates & Semiconductor Solutions Event
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Exhibition We are excited to announce our participation in SEMICON Europa! At our booth, we will showcase our range of glass substrates for semiconductor manufacturing, including carrier wafers, adapters and tools, as well as glass wafers for the encapsulation […]
IMPACT-IAAC
Advanced Packaging Event
Your Content Goes Here Conference We are very happy to participate in the IMPACT IAAC Conference! Our team will be at the there to connect with industry experts and discuss the latest developments in advanced packaging. We are also excited to contribute to the technical program […]
IMAPS Symposium
Advanced Packaging Event
Your Content Goes Here Conference
Meet PLANOPTIK at IMAPS Symposium 2026 – the top conference for microelectronics advanced packaging and discover our portfolio of glass core substrates and glass substrates for Wafer-and Panel-Level Packaging. From high-precision glass substrates to customized solutions, we showcase how glass enables […]
IEEE – ECTC
Advanced Packaging Event
Your Content Goes Here Conference & Exhibition Meet PLANOPTIK at the IEEE Electronics System-Integration Technology Conference (IEEE ESTC) – the premier international event in the field of electronics packaging and system integration.
At ESTC, our focus is on Glass Core Substrates for Advanced packaging, which enable ultra-compact […]