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Events
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Exhibitions
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Advanced Substrates & Semiconductor Solutions Event
Semicon Europa
Exhibition
Event details to follow…
Showcase products
> Glass Core Substrates for Advanced Packaging
> Carrier Wafers, Adapters and Tools
Meet PLANOPTIK at
Booth number to follow
Contact
Jonas Discher
+49 2664 5068 21
[email protected]
Website
Organizer
SEMI Europe
[email protected]
Advanced Substrates & Semiconductor Solutions Event
Semicon Japan
Exhibition
Event details to follow…
Showcase products
> Glass Core Substrates for Advanced Packaging
> Wafers for Wafer-Level Packaging
> Carrier Wafers, Adapters and Tools
Meet PLANOPTIK at
Booth number to follow
Contact
Jonas Discher
+49 2664 5068 21
[email protected]
Website
Organizer
SEMI Japan
[email protected]
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Conferences
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Advanced Packaging Event
IEEE ESTC
Conference
Meet PLANOPTIK at the IEEE Electronics System-Integration Technology Conference (IEEE ESTC) – the premier international event in the field of electronics packaging and system integration.
At ESTC, our focus is on Glass Core Substrates for Advanced packaging, which enable ultra-compact microchip arrangements, enhancing performance, energy efficiency and device miniaturization. Additionally, we will showcase our wide range of Glass substrates for Wafer- and Panel-Level-Packaging and many other products. Make sure to stop by our booth to talk about glass substates for your application.
Showcase products
> Glass Core Substrates for Advanced Packaging
> Wafers for Wafer-Level Packaging
Meet PLANOPTIK at
Booth 23
Contact
Jonas Discher
+49 2664 5068 21
[email protected]
Website
Organizer
IEEE Electronics Packaging Society
[email protected]
Advanced Packaging Event
IMAPS Symposium
Conference
Event details to follow…
Showcase products
> Glass Core Substrates for Advanced Packaging
> Wafers for Wafer-Level Packaging
Meet PLANOPTIK at
Booth number to follow
Speaker
Martin Mustermann
About Advanced Packaging
September 10
Contact
Jonas Discher
+49 2664 5068 21
[email protected]
Website
Organizer
International Microelectronics Assembly and Packaging Society
[email protected]
Microfluidics Event
μTAS
Conference
Event details to follow…
Showcase products
> Microsystems for Flow Chemistry
> Components for Life Science
Meet PLANOPTIK at
Booth number to follow
Contact
Jonas Discher
+49 2664 5068 21
[email protected]
Website
Organizer
CBMS
[email protected]
Advanced Packaging Event
IMPACT-IAAC
Conference
Event details to follow…
Showcase products
> Glass Core Substrates for Advanced Packaging
> Wafers for Wafer-Level Packaging
Date
October 19 – 22, 2026
Venue
Nangang International Exhibition Center, Hall 2, Taipei,
Taiwan
> Google Map
Meet PLANOPTIK at
Booth number to follow
Speaker
Martin Mustermann
About Advanced Packaging
September 10
Contact
Jonas Discher
+49 2664 5068 21
[email protected]
Website
Organizer
IMPACT
[email protected]
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Team up with PLANOPTIK
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Individually developed
Are you developing a new microsystem? Are you combining microelectronics, micromechanics or microfluidics to create a new product? Are you developing a sensor, an electronic device, a fluidic system or something that has never existed before? Team up with PLANOPTIK.
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Reliable partnership
In us you will find a partner who will work with you to develop electronic, mechanical, optical, chemical or biological microcomponents and has a firm grasp of materials such as glass, silicon and copper.
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Together until production
PLANOPTIK also manufactures the jointly developed microcomponents and elements in high volumes using state-of-the-art wafer-based manufacturing processes.