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It’s about precision

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From raw material to high-performance substrates and components

PLANOPTIK offers a wide range of proven technologies for developing and manufacturing a variety of products at wafer and panel level.

Our wafers are made of different glass or quartz materials and are available in sizes up to 300 mm diameter with a high-precision surface quality and application-specific structuring or complex material combi­nations. With our range of technologies we can not only process wafers but also panels or microfluidic devices.

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Shaping

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Transforming glass into wafers and panels

Shaping

The production of wafers and panels begins with the raw material. Using precise processes, the material is cut into wafers or panels with various geometries. These processes include for example:

– DIAMOND CUTTING
– WATER-JET CUTTING
– WIRE SAWING
– EDGE GRINDING

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Surface Treatment and Finishing

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From substrates to products with high-precision surfaces

Next, various steps are taken to achieve the quality and dimensional accuracy specified by the customer. Therefore, the following processes could be used:

– GRINDING
– POLISHING

– Regular Polishing
– MDF polishing

Our processes enable us to achieve high quality surfaces with

  • Thickness down to 200 μm
  • TTV from 1 µm (depending on wafer thickness and diameter)
  • Surface roughness down ≤ 0.5 nm (Ra)
MDF polishing

Our MDF polishing process allows a clean etching process

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Patterning

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Advanced patterning on high-precision surfaces

Glass structuring enables the creation of functional features and precise geometries for a wide range of high-tech applications. Depending on the required feature size, geometry, depth, and surface quality, different structuring technologies are employed.

These include for example sandblasting for larger-scale structures and cavities, laser processing for highly flexible and precise material modifi­cation, chemical etching for smooth and accurate microstruc­tures, and laser-etching for complex three-dimensional features with high precision.

Selecting the appropriate structuring method is essential to achieve the desired performance, accuracy, and cost efficiency of the final compo­nent. Examples of such modifications could include:

Through Glass VIAS

Through Glass VIAS

Blind holes

Blind holes

Cavities

Cavities

Channels

Channels

Markings

Markings

Through-Glass-Vias

Hole diameter >=30µm

Hole diameter >=30µm

Tapered TGV

Nearly straight TGV

Nearly straight TGV

Pitch twice hole diameter

Pitch twice hole diameter

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Further Processing

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Enabling functionality through advanced process steps

Following the structuring process, additional manufacturing steps are often required to transform the substrate into a fully functional component. Depending on the application, these processes may include metallization for electrical conductivity, coating to enhance optical, mechanical, or chemical properties, bonding for the integration of multiple materials or components, and dicing for the separation of individual devices.

The selection and combination of these processes are tailored to the specific product requirements, ensuring optimal functionality, reliability, and performance in demanding high-tech applications.

Glass for Advanced Packaging

Metallisation

Full-Surface copper metallization
by cu-liner strategy

  • Substrate material: Borofloat33, quartz
  • Wafer Diameter: up to 300 mm
  • Panel Dimension: up to 300 x 300 mm
  • Panel Dimension: up to 300 x 300 mm
  • Substrate thickness: 300 – 1000 μm
  • Hole diameter: ≥75 μm
  • Pitch: twice hole diameter
  • Cu thickness: 2..10 μm

Redistribution layer

  • Customized RDL up to 200 mm diameter
  • Line / Space: 50 µm / 50 µm
Metallisation
Lithography

Lithography

  • Dry resist
  • Solder Mask
Various Coatings

Various Coatings

  • ITO
  • Titanium
  • Copper
  • Alu
  • Chrome
Bonding

Bonding

Dicing

Dicing

Lithography

Lithography

  • Dry resist
  • Solder Mask
Various Coatings

Various Coatings

  • ITO
  • Titanium
  • Copper
  • Alu
  • Chrome

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Team up with PLANOPTIK

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Team up with PlanOptik
Team up with PlanOptik

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Individually developed

Are you developing a new microsystem? Are you combining microelectronics, micromecha­nics or microfluidics to create a new product? Are you developing a sensor, an electronic device, a fluidic system or something that has never existed before? Team up with PLANOPTIK.

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Reliable partnership

In us you will find a partner who will work with you to develop electronic, mechanical, optical, chemical or biological microcomponents and has a firm grasp of materials such as glass, silicon and copper.

Team up with PlanOptik

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Together until production

PLANOPTIK also manufactures the jointly deve­loped microcomponents and elements in high volumes using state-of-the-art wafer-based manufacturing processes.