IMAPS Symposium

Advanced Packaging Event

Meet PLANOPTIK at IMAPS Symposium 2026 – the top conference for microelectronics advanced packaging and discover our portfolio of glass core substrates and glass substrates for Wafer-and Panel-Level Packaging. From high-precision glass substrates to customized solutions, we showcase how glass enables innovative packaging concepts for the next generation of microelectronics. Visit us on-site and explore our solutions!

Showcase products
> Glass Core Substrates for Advanced Packaging
> Wafers for Wafer-Level Packaging