IEEE ESTC

Advanced Packaging Event

Meet PLANOPTIK at the IEEE Electronics System-Integration Technology Conference (IEEE ESTC) – the premier international event in the field of electronics packaging and system integration.

At ESTC, our focus is on Glass Core Substrates for Advanced packaging, which enable ultra-compact microchip arrangements, enhancing performance, energy efficiency and device miniaturization. Additionally, we will showcase our wide range of Glass substrates for Wafer- and Panel-Level-Packaging and many other products. Make sure to stop by our booth to talk about glass substates for your application.

Showcase products
> Glass Core Substrates for Advanced Packaging
> Wafers for Wafer-Level Packaging