Advanced Packaging Event

IMPACT-IAAC

Conference

We are very happy to participate in the IMPACT IAAC Conference! Our team will be at the there to connect with industry experts and discuss the latest developments in advanced packaging. We are also excited to contribute to the technical program with a presentation highlighting our glass core substrates and glass wafers for wafer-level and panel-level packaging. We look forward to meeting you there!

Showcase products
> Glass Core Substrates for Advanced Packaging
> Wafers for Wafer-Level Packaging
> Carrier Wafers, Adapters & Tools

IMPACT-IAAC
Date

October 19 – 22, 2026

Venue

Nangang International Exhibition Center, Hall 2, Taipei,
Taiwan
> Google Map

Meet PLANOPTIK at

Booth number to follow

Contact
Website
Organizer