Advanced Packaging Event
IMPACT-IAAC
Conference
We are very happy to participate in the IMPACT IAAC Conference! Our team will be at the there to connect with industry experts and discuss the latest developments in advanced packaging. We are also excited to contribute to the technical program with a presentation highlighting our glass core substrates and glass wafers for wafer-level and panel-level packaging. We look forward to meeting you there!
Showcase products
> Glass Core Substrates for Advanced Packaging
> Wafers for Wafer-Level Packaging
> Carrier Wafers, Adapters & Tools
Date
October 19 – 22, 2026
Venue
Nangang International Exhibition Center, Hall 2, Taipei,
Taiwan
> Google Map
Meet PLANOPTIK at
Booth number to follow
Contact
Jonas Discher
+49 2664 5068 21
[email protected]
Website
Organizer
IMPACT
[email protected]

