IEEE – ECTC

Advanced Packaging Event

Meet us at the Electronic Components and Technology Conference (ECTC) 2027 – the leading international confe­rence for semiconductor packaging, bringing together industry experts, researchers and technology providers to explore the latest innovations in electronic packaging and microelectronic systems. We are excited to exhibit and showcase our wide range of glass wafers and panels, espa­cially for advanced packaging and wafer-level packaging (WLP). Discover how our glass solutions can support inno­vative packaging technologies and next-generation semi­conductor applications. We look forward to meeting you there!

Showcase products
> Glass Core Substrates for Advanced Packaging
> Glass Wafers, Quartz Wafers & Silicon Wafers