Advanced Packaging Event
IMPACT-IAAC
Conference
We are very happy to participate in the IMPACT IAAC Conference! Our team will be at the there to connect with industry experts and discuss the latest developments in advanced packaging. We are also excited to contribute to the technical program with a presentation highlighting our glass core substrates and glass wafers for wafer-level and panel-level packaging. We look forward to meeting you there!
Showcase products
> Glass Core Substrates for Advanced Packaging
> Wafers for Wafer-Level Packaging
> Carrier Wafers, Adapters & Tools
Date
October 19 – 22, 2026
Presentation date
Tuesday October 20th
Session S9 Glass substrate 13:00 – 15:00
701A, 7F, TaiNEX 2
Venue
Nangang International Exhibition Center, Hall 2, Taipei,
Taiwan
> Google Map
Presentation
Speaker
Jonas Discher
+49 2664 5068 21
[email protected]
Website
Organizer
IMPACT
[email protected]
Microfluidics Event
µTAS
Conference
Visit us at µTas to discover our high-precision solutions for microfluidics and life science applications. We will showcase customized microfluidic chips and components made of glass, quartz and silicon for applications such as lab-on-chip, diagnostics, droplet microfluidics, particle handling and optofluidics.
From precise microchannels, cavities and through-holes to optical windows and bonded assemblies, we support the development of microfluidic devices from prototype to series production. Discover the advantages of glass and quartz for demanding microfluidic applications. We look forward to meeting you in Granada!
Showcase products
> Microstructured components for life science applications
> Glass Microreactors and Micromixers
Meet PLANOPTIK at
Booth #38
Contact
Markus Schneider
+49 2664 5068 34
[email protected]
Website
Organizer
CBMS
[email protected]
Advanced Packaging Event
IMAPS Symposium
Conference
Meet PLANOPTIK at IMAPS Symposium 2026 – the top conference for microelectronics advanced packaging and discover our portfolio of glass core substrates and glass substrates for Wafer-and Panel-Level Packaging. From high-precision glass substrates to customized solutions, we showcase how glass enables innovative packaging concepts for the next generation of microelectronics. Visit us on-site and explore our solutions!
Showcase products
> Glass Core Substrates for Advanced Packaging
> Wafers for Wafer-Level Packaging
Meet PLANOPTIK at
Booth #513
Contact
Jonas Discher
+49 2664 5068 21
[email protected]
Website
Organizer
International Microelectronics Assembly and Packaging Society
[email protected]
Advanced Packaging Event
IEEE – ECTC
Conference & Exhibition
Meet PLANOPTIK at the IEEE Electronics System-Integration Technology Conference (IEEE ESTC) – the premier international event in the field of electronics packaging and system integration.
At ESTC, our focus is on Glass Core Substrates for Advanced packaging, which enable ultra-compact microchip arrangements, enhancing performance, energy efficiency and device miniaturization. Additionally, we will showcase our wide range of Glass substrates for Wafer- and Panel-Level-Packaging and many other products. Make sure to stop by our booth to talk about glass substates for your application.
Showcase products
> Glass Core Substrates for Advanced Packaging
> Wafers for Wafer-Level Packaging
Meet PLANOPTIK at
Booth #23
Contact
Jonas Discher
+49 2664 5068 21
[email protected]
Website
Organizer
IEEE Electronics Packaging Society
[email protected]