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Glass Core Substrates
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PLANOPTIK develops Glass Core Substrates for advanced packaging, providing a high-precision platform for attaching and interconnecting microchips and semiconductor components.
The glass core is processed with fine through-glass vias and copper metallization, enabling reliable routing and high-density electrical interfaces using wafer-level manufacturing and lithographic structuring.
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Glass Core Substrates enable chips and sensors to be stacked in the smallest of spaces.
Individually developed.
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Discover the technologies we offer to shape Glass Core Substrates for Advanced Packaging. Individually developed and manufactured from R&D to high volumes.
– THROUGH-GLASS-VIAS
– METALLIZIATION
– CAVITIES
– DIFFERENT GLASS TYPES
– MDF POLISHING
– MARKINGS
– DICING
– REDISTRIBUTION LAYER (RDL)
– SOLDER MASK
Metallisation
Through Glass VIAS
Solder mask
Redistribution layer
MDF Polishing
Dicing
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Glass – the best choice
for Advanced Packaging
Glass – the best choice for Advanced Packaging
Glass is becoming a key material for advanced packaging and high-density interconnects. Compared to conventional organic PCB substrates, glass offers outstanding dimensional stability, electrical insulation and thermal reliability – enabling tighter layouts and more robust packages.
Key advantages of glass vs. classic PCBs:
- Higher dimensional stability for fine-pitch routing and accurate alignment
- Excellent electrical insulation with low signal losses at high frequencies
- Low CTE and high thermal stability for reduced warpage and improved reliability
- High stiffness and flatness for advanced assembly and multi-chip integration
- High-precision through-glass vias (TGVs) for vertical interconnects and dense I/O
These properties make Glass Core Substrates an ideal platform for next-generation semiconductor packaging, especially for high-performance computing and RF applications.
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3D Packaging based on
Glass Core Substrates
3D Packaging based on Glass Core Substrates
Glass Core Substrates are used in advanced packaging to connect and integrate multiple chips and electronic components in one compact module. Acting as a high-precision interconnect platform, they enable dense routing and reliable signal transmission – especially when space is limited and performance requirements are high.
This makes Glass Core Substrates ideal for next-generation electronics such as AI hardware, high-speed data communication, and RF applications, where smaller, faster and more energy-efficient devices are required.
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Interposers
and structured
Glass Core Substrates
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A key application for Glass Core Substrates is interposers. Interposers act as high-density routing layers that connect multiple chips within one package, enabling compact multi-chip modules and 2.5D integration. PLANOPTIK manufactures glass interposers using wafer-based processes.
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How to create a Glass Core Substrate
Glass wafer with micro holes, copper coated
Wafer additionally coated with solder resist
Interposer after dicing
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Team up with PLANOPTIK
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Individually developed
Are you developing a new microsystem? Are you combining microelectronics, micromechanics or microfluidics to create a new product? Are you developing a sensor, an electronic device, a fluidic system or something that has never existed before? Team up with PLANOPTIK.
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Reliable partnership
In us you will find a partner who will work with you to develop electronic, mechanical, optical, chemical or biological microcomponents and has a firm grasp of materials such as glass, silicon and copper.
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Together until production
PLANOPTIK also manufactures the jointly developed microcomponents and elements in high volumes using state-of-the-art wafer-based manufacturing processes.