Advanced Packaging Event<\/p>\n<\/div><\/div><\/div>
IMPACT-IAAC<\/h2><\/div>Conference<\/h4><\/div>We are very happy to participate in the IMPACT IAAC Conference! Our team will be at the there to connect with industry experts and discuss the latest developments in advanced packaging. We are also excited to contribute to the technical program with a presentation highlighting our glass core substrates and glass wafers for wafer-level and panel-level packaging. We look forward to meeting you there!<\/p>\n
Showcase products
\n> Glass Core Substrates for Advanced Packaging<\/a>
\n> Wafers for Wafer-Level Packaging<\/a>
\n> Carrier Wafers, Adapters & Tools<\/a><\/p>\n<\/div><\/div><\/div>![\"IMPACT-IAAC\"](\"https:\/\/www.planoptik.com\/wp-content\/uploads\/2026\/09\/event-impact-iaac-conference-taiwan.webp\")
<\/a><\/span><\/div><\/div><\/div>Date<\/h6><\/div>October 19 \u2013 22, 2026<\/p>\n<\/div>
<\/div><\/div>Presentation date<\/h6><\/div>Tuesday October 20th
\nSession S9 Glass substrate 13:00 \u2013 15:00
\n701A, 7F, TaiNEX 2<\/p>\n<\/div>
<\/div><\/div>Venue<\/h6><\/div>Nangang International Exhibition Center, Hall 2, Taipei,
\nTaiwan
\n> Google Map<\/a><\/p>\n<\/div><\/div><\/div><\/div><\/div>Presentation<\/h6><\/div>> Material and Integration Requirements of Fused Silica Glass Core Substrates for High-Frequency Packaging (PDF 364 KB)<\/a><\/p>\n<\/div><\/div><\/div>Speaker<\/h6><\/div>Jonas Discher
\n+49 2664 5068 21<\/a>
\npackaging@planoptik.com<\/a><\/p>\n<\/div><\/div><\/div>Website<\/h6><\/div>www.impact.org.tw<\/a><\/p>\n<\/div><\/div><\/div>Organizer<\/h6><\/div>IMPACT
\nservice@impact.org.tw<\/a><\/p>\n<\/div><\/div><\/div><\/div><\/div><\/div>\n<\/div><\/div><\/div><\/article>\n\nMicrofluidics Event<\/p>\n<\/div><\/div><\/div>
\u00b5TAS<\/h2><\/div>Conference<\/h4><\/div>Visit us at \u00b5Tas to discover our high-precision solutions for microfluidics and life science applications. We will showcase customized microfluidic chips and components made of glass, quartz and silicon for applications such as lab-on-chip, diagnostics, droplet microfluidics, particle handling and optofluidics.<\/p>\n
From precise microchannels, cavities and through-holes to optical windows and bonded assemblies, we support the development of microfluidic devices from prototype to series production. Discover the advantages of glass and quartz for demanding microfluidic applications. We look forward to meeting you in Granada!<\/p>\n
Showcase products
\n> Microstructured components for life science applications<\/a>
\n> Glass Microreactors and Micromixers<\/a><\/p>\n<\/div><\/div><\/div>![\"\u03bcTAS\"](\"https:\/\/www.planoptik.com\/wp-content\/uploads\/2026\/09\/event-micro-tas-conference-spain.webp\")
<\/a><\/span><\/div><\/div><\/div>Date<\/h6><\/div>October 18 \u2013 22, 2026<\/p>\n<\/div>
<\/div><\/div>Venue<\/h6><\/div>Conference & Exhibition Centre Granada
\nSpain
\n> Google Map<\/a><\/p>\n<\/div><\/div><\/div><\/div><\/div>Meet PLANOPTIK at<\/h6><\/div>Booth #38<\/p>\n<\/div>
<\/div><\/div>Contact<\/h6><\/div>Markus Schneider
\n+49 2664 5068 34<\/a>
\nmicrofluidics@planoptik.com<\/a><\/p>\n<\/div><\/div><\/div>Website<\/h6><\/div>www.microtas2026.org<\/a><\/p>\n<\/div><\/div><\/div>Organizer<\/h6><\/div>CBMS
\ninfo@microtas2026.org<\/a><\/p>\n<\/div><\/div><\/div><\/div><\/div><\/div>\n<\/div><\/div><\/div><\/article>\n\nAdvanced Packaging Event<\/p>\n<\/div><\/div><\/div>
IMAPS Symposium<\/h2><\/div>Conference<\/h4><\/div>Meet PLANOPTIK at IMAPS Symposium 2026 \u2013 the top conference for microelectronics advanced packaging and discover our portfolio of glass core substrates and glass substrates for Wafer-and Panel-Level Packaging. From high-precision glass substrates to customized solutions, we showcase how glass enables innovative packaging concepts for the next generation of microelectronics. Visit us on-site and explore our solutions!<\/p>\n
Showcase products
\n> Glass Core Substrates for Advanced Packaging<\/a>
\n> Wafers for Wafer-Level Packaging<\/a><\/p>\n<\/div><\/div><\/div>![](\"https:\/\/www.planoptik.com\/wp-content\/uploads\/2026\/09\/event-imaps-symposium-conference-usa.webp\")
<\/a><\/span><\/div><\/div><\/div>Date<\/h6><\/div>September 28 \u2013 October 1, 2026<\/p>\n<\/div>
<\/div><\/div>Venue<\/h6><\/div>Encore Boston Harbor, Boston
\nUSA
\n> Google Map<\/a><\/p>\n<\/div><\/div><\/div><\/div><\/div>Meet PLANOPTIK at<\/h6><\/div>Booth #513<\/p>\n<\/div>
<\/div><\/div>Contact<\/h6><\/div>Jonas Discher
\n+49 2664 5068 21<\/a>
\npackaging@planoptik.com<\/a><\/p>\n<\/div><\/div><\/div>Website<\/h6><\/div>www.imaps.org<\/a><\/p>\n<\/div><\/div><\/div>Organizer<\/h6><\/div>International Microelectronics Assembly and Packaging Society
\ninfo@imaps.org<\/a><\/p>\n<\/div><\/div><\/div><\/div><\/div><\/div>\n<\/div><\/div><\/div><\/article>\n\nAdvanced Packaging Event<\/p>\n<\/div><\/div><\/div>
IEEE – ECTC<\/h2><\/div>Conference & Exhibition<\/h4><\/div>Meet PLANOPTIK at the IEEE Electronics System-Integration Technology Conference (IEEE ESTC) \u2013 the premier international event in the field of electronics packaging and system integration.<\/p>\n
At ESTC, our focus is on Glass Core Substrates for Advanced packaging, which enable ultra-compact microchip arrangements, enhancing performance, energy efficiency and device miniaturization. Additionally, we will showcase our wide range of Glass substrates for Wafer- and Panel-Level-Packaging and many other products. Make sure to stop by our booth to talk about glass substates for your application.<\/p>\n
Showcase products
\n> Glass Core Substrates for Advanced Packaging<\/a>
\n> Wafers for Wafer-Level Packaging<\/a><\/p>\n<\/div><\/div><\/div>
Conference<\/h4><\/div>We are very happy to participate in the IMPACT IAAC Conference! Our team will be at the there to connect with industry experts and discuss the latest developments in advanced packaging. We are also excited to contribute to the technical program with a presentation highlighting our glass core substrates and glass wafers for wafer-level and panel-level packaging. We look forward to meeting you there!<\/p>\n
Showcase products
\n> Glass Core Substrates for Advanced Packaging<\/a>
\n> Wafers for Wafer-Level Packaging<\/a>
\n> Carrier Wafers, Adapters & Tools<\/a><\/p>\n<\/div><\/div><\/div><\/a><\/span><\/div><\/div><\/div>Date<\/h6><\/div>October 19 \u2013 22, 2026<\/p>\n<\/div>
<\/div><\/div>Presentation date<\/h6><\/div>Tuesday October 20th
\nSession S9 Glass substrate 13:00 \u2013 15:00
\n701A, 7F, TaiNEX 2<\/p>\n<\/div>
<\/div><\/div>Venue<\/h6><\/div>Nangang International Exhibition Center, Hall 2, Taipei,
\nTaiwan
\n> Google Map<\/a><\/p>\n<\/div><\/div><\/div><\/div><\/div>Presentation<\/h6><\/div>> Material and Integration Requirements of Fused Silica Glass Core Substrates for High-Frequency Packaging (PDF 364 KB)<\/a><\/p>\n<\/div><\/div><\/div>Speaker<\/h6><\/div>Jonas Discher
\n+49 2664 5068 21<\/a>
\npackaging@planoptik.com<\/a><\/p>\n<\/div><\/div><\/div>Website<\/h6><\/div>www.impact.org.tw<\/a><\/p>\n<\/div><\/div><\/div>Organizer<\/h6><\/div>IMPACT
\nservice@impact.org.tw<\/a><\/p>\n<\/div><\/div><\/div><\/div><\/div><\/div>\n<\/div><\/div><\/div><\/article>\n\nMicrofluidics Event<\/p>\n<\/div><\/div><\/div>
\u00b5TAS<\/h2><\/div>Conference<\/h4><\/div>Visit us at \u00b5Tas to discover our high-precision solutions for microfluidics and life science applications. We will showcase customized microfluidic chips and components made of glass, quartz and silicon for applications such as lab-on-chip, diagnostics, droplet microfluidics, particle handling and optofluidics.<\/p>\n
From precise microchannels, cavities and through-holes to optical windows and bonded assemblies, we support the development of microfluidic devices from prototype to series production. Discover the advantages of glass and quartz for demanding microfluidic applications. We look forward to meeting you in Granada!<\/p>\n
Showcase products
\n> Microstructured components for life science applications<\/a>
\n> Glass Microreactors and Micromixers<\/a><\/p>\n<\/div><\/div><\/div><\/a><\/span><\/div><\/div><\/div>Date<\/h6><\/div>October 18 \u2013 22, 2026<\/p>\n<\/div>
<\/div><\/div>Venue<\/h6><\/div>Conference & Exhibition Centre Granada
\nSpain
\n> Google Map<\/a><\/p>\n<\/div><\/div><\/div><\/div><\/div>Meet PLANOPTIK at<\/h6><\/div>Booth #38<\/p>\n<\/div>
<\/div><\/div>Contact<\/h6><\/div>Markus Schneider
\n+49 2664 5068 34<\/a>
\nmicrofluidics@planoptik.com<\/a><\/p>\n<\/div><\/div><\/div>Website<\/h6><\/div>www.microtas2026.org<\/a><\/p>\n<\/div><\/div><\/div>Organizer<\/h6><\/div>CBMS
\ninfo@microtas2026.org<\/a><\/p>\n<\/div><\/div><\/div><\/div><\/div><\/div>\n<\/div><\/div><\/div><\/article>\n\nAdvanced Packaging Event<\/p>\n<\/div><\/div><\/div>
IMAPS Symposium<\/h2><\/div>Conference<\/h4><\/div>Meet PLANOPTIK at IMAPS Symposium 2026 \u2013 the top conference for microelectronics advanced packaging and discover our portfolio of glass core substrates and glass substrates for Wafer-and Panel-Level Packaging. From high-precision glass substrates to customized solutions, we showcase how glass enables innovative packaging concepts for the next generation of microelectronics. Visit us on-site and explore our solutions!<\/p>\n
Showcase products
\n> Glass Core Substrates for Advanced Packaging<\/a>
\n> Wafers for Wafer-Level Packaging<\/a><\/p>\n<\/div><\/div><\/div><\/a><\/span><\/div><\/div><\/div>Date<\/h6><\/div>September 28 \u2013 October 1, 2026<\/p>\n<\/div>
<\/div><\/div>Venue<\/h6><\/div>Encore Boston Harbor, Boston
\nUSA
\n> Google Map<\/a><\/p>\n<\/div><\/div><\/div><\/div><\/div>Meet PLANOPTIK at<\/h6><\/div>Booth #513<\/p>\n<\/div>
<\/div><\/div>Contact<\/h6><\/div>Jonas Discher
\n+49 2664 5068 21<\/a>
\npackaging@planoptik.com<\/a><\/p>\n<\/div><\/div><\/div>Website<\/h6><\/div>www.imaps.org<\/a><\/p>\n<\/div><\/div><\/div>Organizer<\/h6><\/div>International Microelectronics Assembly and Packaging Society
\ninfo@imaps.org<\/a><\/p>\n<\/div><\/div><\/div><\/div><\/div><\/div>\n<\/div><\/div><\/div><\/article>\n\nAdvanced Packaging Event<\/p>\n<\/div><\/div><\/div>
IEEE – ECTC<\/h2><\/div>Conference & Exhibition<\/h4><\/div>Meet PLANOPTIK at the IEEE Electronics System-Integration Technology Conference (IEEE ESTC) \u2013 the premier international event in the field of electronics packaging and system integration.<\/p>\n
At ESTC, our focus is on Glass Core Substrates for Advanced packaging, which enable ultra-compact microchip arrangements, enhancing performance, energy efficiency and device miniaturization. Additionally, we will showcase our wide range of Glass substrates for Wafer- and Panel-Level-Packaging and many other products. Make sure to stop by our booth to talk about glass substates for your application.<\/p>\n
Showcase products
\n> Glass Core Substrates for Advanced Packaging<\/a>
\n> Wafers for Wafer-Level Packaging<\/a><\/p>\n<\/div><\/div><\/div>
We are very happy to participate in the IMPACT IAAC Conference! Our team will be at the there to connect with industry experts and discuss the latest developments in advanced packaging. We are also excited to contribute to the technical program with a presentation highlighting our glass core substrates and glass wafers for wafer-level and panel-level packaging. We look forward to meeting you there!<\/p>\n
Showcase products October 19 \u2013 22, 2026<\/p>\n<\/div> Tuesday October 20th Nangang International Exhibition Center, Hall 2, Taipei, > Material and Integration Requirements of Fused Silica Glass Core Substrates for High-Frequency Packaging (PDF 364 KB)<\/a><\/p>\n<\/div> Jonas Discher www.impact.org.tw<\/a><\/p>\n<\/div> IMPACT Microfluidics Event<\/p>\n<\/div><\/div><\/div> Visit us at \u00b5Tas to discover our high-precision solutions for microfluidics and life science applications. We will showcase customized microfluidic chips and components made of glass, quartz and silicon for applications such as lab-on-chip, diagnostics, droplet microfluidics, particle handling and optofluidics.<\/p>\n From precise microchannels, cavities and through-holes to optical windows and bonded assemblies, we support the development of microfluidic devices from prototype to series production. Discover the advantages of glass and quartz for demanding microfluidic applications. We look forward to meeting you in Granada!<\/p>\n Showcase products October 18 \u2013 22, 2026<\/p>\n<\/div> Conference & Exhibition Centre Granada Booth #38<\/p>\n<\/div> Markus Schneider www.microtas2026.org<\/a><\/p>\n<\/div> CBMS Advanced Packaging Event<\/p>\n<\/div><\/div><\/div> Meet PLANOPTIK at IMAPS Symposium 2026 \u2013 the top conference for microelectronics advanced packaging and discover our portfolio of glass core substrates and glass substrates for Wafer-and Panel-Level Packaging. From high-precision glass substrates to customized solutions, we showcase how glass enables innovative packaging concepts for the next generation of microelectronics. Visit us on-site and explore our solutions!<\/p>\n Showcase products September 28 \u2013 October 1, 2026<\/p>\n<\/div> Encore Boston Harbor, Boston Booth #513<\/p>\n<\/div> Jonas Discher www.imaps.org<\/a><\/p>\n<\/div> International Microelectronics Assembly and Packaging Society Advanced Packaging Event<\/p>\n<\/div><\/div><\/div> Meet PLANOPTIK at the IEEE Electronics System-Integration Technology Conference (IEEE ESTC) \u2013 the premier international event in the field of electronics packaging and system integration.<\/p>\n At ESTC, our focus is on Glass Core Substrates for Advanced packaging, which enable ultra-compact microchip arrangements, enhancing performance, energy efficiency and device miniaturization. Additionally, we will showcase our wide range of Glass substrates for Wafer- and Panel-Level-Packaging and many other products. Make sure to stop by our booth to talk about glass substates for your application.<\/p>\n Showcase products
\n> Glass Core Substrates for Advanced Packaging<\/a>
\n> Wafers for Wafer-Level Packaging<\/a>
\n> Carrier Wafers, Adapters & Tools<\/a><\/p>\n<\/div><\/div><\/div><\/a><\/span><\/div>Date<\/h6><\/div>
Presentation date<\/h6><\/div>
\nSession S9 Glass substrate 13:00 \u2013 15:00
\n701A, 7F, TaiNEX 2<\/p>\n<\/div>Venue<\/h6><\/div>
\nTaiwan
\n> Google Map<\/a><\/p>\n<\/div>Presentation<\/h6><\/div>
Speaker<\/h6><\/div>
\n+49 2664 5068 21<\/a>
\npackaging@planoptik.com<\/a><\/p>\n<\/div>Website<\/h6><\/div>
Organizer<\/h6><\/div>
\nservice@impact.org.tw<\/a><\/p>\n<\/div><\/div><\/div><\/div><\/div><\/div>\n<\/div><\/div>\u00b5TAS<\/h2><\/div>
Conference<\/h4><\/div>
\n> Microstructured components for life science applications<\/a>
\n> Glass Microreactors and Micromixers<\/a><\/p>\n<\/div><\/div><\/div><\/a><\/span><\/div>Date<\/h6><\/div>
Venue<\/h6><\/div>
\nSpain
\n> Google Map<\/a><\/p>\n<\/div>Meet PLANOPTIK at<\/h6><\/div>
Contact<\/h6><\/div>
\n+49 2664 5068 34<\/a>
\nmicrofluidics@planoptik.com<\/a><\/p>\n<\/div>Website<\/h6><\/div>
Organizer<\/h6><\/div>
\ninfo@microtas2026.org<\/a><\/p>\n<\/div><\/div><\/div><\/div><\/div><\/div>\n<\/div><\/div>IMAPS Symposium<\/h2><\/div>
Conference<\/h4><\/div>
\n> Glass Core Substrates for Advanced Packaging<\/a>
\n> Wafers for Wafer-Level Packaging<\/a><\/p>\n<\/div><\/div><\/div><\/a><\/span><\/div>Date<\/h6><\/div>
Venue<\/h6><\/div>
\nUSA
\n> Google Map<\/a><\/p>\n<\/div>Meet PLANOPTIK at<\/h6><\/div>
Contact<\/h6><\/div>
\n+49 2664 5068 21<\/a>
\npackaging@planoptik.com<\/a><\/p>\n<\/div>Website<\/h6><\/div>
Organizer<\/h6><\/div>
\ninfo@imaps.org<\/a><\/p>\n<\/div><\/div><\/div><\/div><\/div><\/div>\n<\/div><\/div>IEEE – ECTC<\/h2><\/div>
Conference & Exhibition<\/h4><\/div>
\n> Glass Core Substrates for Advanced Packaging<\/a>
\n> Wafers for Wafer-Level Packaging<\/a><\/p>\n<\/div><\/div><\/div>
![\"IEEE](\"https:\/\/www.planoptik.com\/wp-content\/uploads\/2026\/09\/event-ieee-estc-conference-finland.webp\")
<\/a><\/span><\/div>