{"id":6533,"date":"2026-09-04T11:11:18","date_gmt":"2026-09-04T09:11:18","guid":{"rendered":"https:\/\/www.planoptik.com\/?page_id=6533"},"modified":"2026-09-04T15:48:28","modified_gmt":"2026-09-04T13:48:28","slug":"events","status":"publish","type":"page","link":"https:\/\/www.planoptik.com\/en\/about_us\/events\/","title":{"rendered":"PLANOPTIK AG | EVENTS"},"content":{"rendered":"

\u2013<\/p>\n<\/div>

\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n

Events<\/h1><\/div>

\u2013<\/p>\n<\/div>

\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n<\/div><\/div>

Advanced Packaging<\/a><\/span><\/span><\/div><\/div><\/div><\/div><\/div>

IEEE ESTC<\/h2><\/div><\/div><\/div>
<\/div><\/div><\/div>

September 9 \u2013 11, 2026<\/p>\n<\/div><\/div><\/div>

Conference<\/a><\/span><\/span><\/div><\/div><\/div>

Helsinki, Finland
\n> View Details<\/a><\/p>\n<\/div><\/div><\/div><\/div><\/div>\n<\/div><\/div><\/div>\n

Advanced Packaging<\/a><\/span><\/span><\/div><\/div><\/div><\/div><\/div>

IMAPS Symposium<\/h2><\/div><\/div><\/div>

September 28 \u2013 October 1, 2026<\/p>\n<\/div><\/div><\/div>

Conference<\/a><\/span><\/span><\/div><\/div><\/div>

Boston, USA
\n> View Details<\/a><\/p>\n<\/div><\/div><\/div><\/div><\/div>\n<\/div><\/div><\/div>\n

Microfluidics<\/a><\/span><\/span><\/div><\/div><\/div><\/div><\/div>

µTAS<\/h2><\/div><\/div><\/div>
<\/div><\/div><\/div>

October 18 \u2013 22, 2026<\/p>\n<\/div><\/div><\/div>

Conference<\/a><\/span><\/span><\/div><\/div><\/div>

Granada, Spain
\n> View Details<\/a><\/p>\n<\/div><\/div><\/div><\/div><\/div>\n<\/div><\/div><\/div>\n

Advanced Packaging<\/a><\/span><\/span><\/div><\/div><\/div><\/div><\/div>

Impact-IAAC<\/h2><\/div><\/div><\/div>
<\/div><\/div><\/div>

October 19 \u2013 22, 2026<\/p>\n<\/div><\/div><\/div>

Conference<\/a><\/span><\/span><\/div><\/div><\/div>

Taipei, Taiwan
\n> View Details<\/a><\/p>\n<\/div><\/div><\/div><\/div><\/div>\n<\/div><\/div><\/div>\n

Glass Core Substrates<\/a><\/span><\/span><\/div><\/div><\/div><\/div><\/div>

Semicon Europa<\/h2><\/div><\/div><\/div>

November 10 \u2013 13, 2026<\/p>\n<\/div><\/div><\/div>

Exhibition<\/a><\/span><\/span><\/div><\/div><\/div>

Munich, Germany
\n> View Details<\/a><\/p>\n<\/div><\/div><\/div><\/div><\/div>\n<\/div><\/div><\/div>\n

Glass Core Substrates<\/a><\/span><\/span><\/div><\/div><\/div><\/div><\/div>

Semicon Japan<\/h2><\/div><\/div><\/div>

December 9 \u2013 11, 2026<\/p>\n<\/div><\/div><\/div>

Exhibition<\/a><\/span><\/span><\/div><\/div><\/div>

Tokyo, Japan
\n> View Details<\/a><\/p>\n<\/div><\/div><\/div><\/div><\/div>\n<\/div><\/div><\/div>\n<\/div>

<\/i><\/div>
<\/i><\/div><\/div><\/div><\/div><\/div><\/div>

\u2013<\/p>\n<\/div>

\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n

Exhibitions<\/h2><\/div>

\u2013<\/p>\n<\/div>

\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n<\/div><\/div><\/div><\/div><\/div>\n

Advanced Substrates & Semiconductor Solutions Event<\/p>\n<\/div><\/div><\/div>

Semicon Europa<\/h2><\/div>

Exhibition<\/h4><\/div>

Event details to follow\u2026<\/p>\n

Showcase products
\n> Glass Core Substrates for Advanced Packaging<\/a>
\n> Carrier Wafers, Adapters and Tools<\/a><\/p>\n<\/div><\/div><\/div>

\"Semicon<\/a><\/span><\/div>
<\/div>
<\/div>
Date<\/h6><\/div>

November 10 \u2013 13, 2026<\/p>\n<\/div>

<\/div><\/div>
Venue<\/h6><\/div>

Trade Fair Center Messe M\u00fcnchen, Munich
\nGermany
\n> Google Map<\/a><\/p>\n<\/div>

<\/div><\/div><\/div><\/div>
Meet PLANOPTIK at<\/h6><\/div>

Booth number to follow<\/p>\n<\/div>

<\/div><\/div>
Contact<\/h6><\/div>

Jonas Discher
\n+49 2664 5068 21<\/a>
\npackaging@planoptik.com<\/a><\/p>\n<\/div>

<\/div><\/div>
Website<\/h6><\/div>

www.semiconeuropa.org<\/a><\/p>\n<\/div>

<\/div><\/div>
Organizer<\/h6><\/div>

SEMI Europe
\nsemiconeuropa@semi.org<\/a><\/p>\n<\/div><\/div><\/div><\/div><\/div><\/div>\n

Advanced Substrates & Semiconductor Solutions Event<\/p>\n<\/div><\/div><\/div>

Semicon Japan<\/h2><\/div>

Exhibition<\/h4><\/div>

Event details to follow\u2026<\/p>\n

Showcase products
\n> Glass Core Substrates for Advanced Packaging<\/a>
\n> Wafers for Wafer-Level Packaging<\/a>
\n> Carrier Wafers, Adapters and Tools<\/a><\/p>\n<\/div><\/div><\/div>

\"Semicon<\/a><\/span><\/div>
<\/div>
<\/div>
Date<\/h6><\/div>

December 9 \u2013 11, 2026<\/p>\n<\/div>

<\/div><\/div>
Venue<\/h6><\/div>

Tokyo Big Sight, Ariake GYM-EX, Tokyo
\nJapan
\n> Google Map<\/a><\/p>\n<\/div>

<\/div><\/div><\/div><\/div>
Meet PLANOPTIK at<\/h6><\/div>

Booth number to follow<\/p>\n<\/div>

<\/div><\/div>
Contact<\/h6><\/div>

Jonas Discher
\n+49 2664 5068 21<\/a>
\npackaging@planoptik.com<\/a><\/p>\n<\/div>

<\/div><\/div>
Website<\/h6><\/div>

www.semiconjapan.org<\/a><\/p>\n<\/div>

<\/div><\/div>
Organizer<\/h6><\/div>

SEMI Japan
\njcustomer@semi.org<\/a><\/p>\n<\/div><\/div><\/div><\/div><\/div><\/div>\n

\u2013<\/p>\n<\/div>

\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n

Conferences<\/h2><\/div>

\u2013<\/p>\n<\/div>

\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n<\/div><\/div><\/div><\/div><\/div>

Advanced Packaging Event<\/p>\n<\/div><\/div><\/div>

IEEE ESTC<\/h2><\/div>

Conference<\/h4><\/div>

Meet PLANOPTIK at the IEEE Electronics System-Integration Technology Conference (IEEE ESTC) \u2013 the premier international event in the field of electronics packaging and system integration.<\/p>\n

At ESTC, our focus is on Glass Core Substrates for Advanced packaging, which enable ultra-compact microchip arrangements, enhancing performance, energy efficiency and device miniaturization. Additionally, we will showcase our wide range of Glass substrates for Wafer- and Panel-Level-Packaging and many other products. Make sure to stop by our booth to talk about glass substates for your application.<\/p>\n

Showcase products
\n> Glass Core Substrates for Advanced Packaging<\/a>
\n> Wafers for Wafer-Level Packaging<\/a><\/p>\n<\/div><\/div><\/div>

\"IEEE<\/a><\/span><\/div>
<\/div>
<\/div>
Date<\/h6><\/div>

September 9 \u2013 11, 2026<\/p>\n<\/div>

<\/div><\/div>
Venue<\/h6><\/div>

Finlandia Hall, Helsinki
\nFinland
\n> Google Map<\/a><\/p>\n<\/div>

<\/div><\/div><\/div><\/div>
Meet PLANOPTIK at<\/h6><\/div>

Booth 23<\/p>\n<\/div>

<\/div><\/div>
Contact<\/h6><\/div>

Jonas Discher
\n+49 2664 5068 21<\/a>
\npackaging@planoptik.com<\/a><\/p>\n<\/div>

<\/div><\/div>
Website<\/h6><\/div>

www.estc-conference.net<\/a><\/p>\n<\/div>

<\/div><\/div>
Organizer<\/h6><\/div>

IEEE Electronics Packaging Society
\noffice@estc-conference.net<\/a><\/p>\n<\/div><\/div><\/div><\/div><\/div><\/div>\n

Advanced Packaging Event<\/p>\n<\/div><\/div><\/div>

IMAPS Symposium<\/h2><\/div>

Conference<\/h4><\/div>

Event details to follow…<\/p>\n

Showcase products
\n> Glass Core Substrates for Advanced Packaging<\/a>
\n> Wafers for Wafer-Level Packaging<\/a><\/p>\n<\/div><\/div><\/div>

<\/a><\/span><\/div>
<\/div>
<\/div>
Date<\/h6><\/div>

September 28 \u2013 October 1, 2026<\/p>\n<\/div>

<\/div><\/div>
Venue<\/h6><\/div>

Encore Boston Harbor, Boston
\nUSA
\n> Google Map<\/a><\/p>\n<\/div>

<\/div><\/div><\/div><\/div>
Meet PLANOPTIK at<\/h6><\/div>

Booth number to follow<\/p>\n<\/div>

<\/div><\/div>
Speaker<\/h6><\/div>

Martin Mustermann
\nAbout Advanced Packaging
\nSeptember 10<\/p>\n<\/div>

<\/div><\/div>
Contact<\/h6><\/div>

Jonas Discher
\n+49 2664 5068 21<\/a>
\npackaging@planoptik.com<\/a><\/p>\n<\/div>

<\/div><\/div>
Website<\/h6><\/div>

www.imaps.org<\/a><\/p>\n<\/div>

<\/div><\/div>
Organizer<\/h6><\/div>

International Microelectronics Assembly and Packaging Society
\ninfo@imaps.org<\/a><\/p>\n<\/div><\/div><\/div><\/div><\/div><\/div>\n

Microfluidics Event<\/p>\n<\/div><\/div><\/div>

\u03bcTAS<\/h2><\/div>

Conference<\/h4><\/div>

Event details to follow…<\/p>\n

Showcase products
\n> Microsystems for Flow Chemistry<\/a>
\n> Components for Life Science<\/a><\/p>\n<\/div><\/div><\/div>

\"\u03bcTAS\"<\/a><\/span><\/div>
<\/div>
<\/div>
Date<\/h6><\/div>

October 18 \u2013 22, 2026<\/p>\n<\/div>

<\/div><\/div>
Venue<\/h6><\/div>

Granada Conference & Exhibition Centre
\nSpain
\n> Google Map<\/a><\/p>\n<\/div>

<\/div><\/div><\/div><\/div>
Meet PLANOPTIK at<\/h6><\/div>

Booth number to follow<\/p>\n<\/div>

<\/div><\/div>
Contact<\/h6><\/div>

Jonas Discher
\n+49 2664 5068 21<\/a>
\npackaging@planoptik.com<\/a><\/p>\n<\/div>

<\/div><\/div>
Website<\/h6><\/div>

www.microtas2026.org<\/a><\/p>\n<\/div>

<\/div><\/div>
Organizer<\/h6><\/div>

CBMS
\ninfo@microtas2026.org<\/a><\/p>\n<\/div><\/div><\/div><\/div><\/div><\/div>\n

Advanced Packaging Event<\/p>\n<\/div><\/div><\/div>

IMPACT-IAAC<\/h2><\/div>

Conference<\/h4><\/div>

Event details to follow…<\/p>\n

Showcase products
\n> Glass Core Substrates for Advanced Packaging<\/a>
\n> Wafers for Wafer-Level Packaging<\/a><\/p>\n<\/div><\/div><\/div>

\"IMPACT-IAAC\"<\/a><\/span><\/div>
<\/div>
<\/div>
Date<\/h6><\/div>

October 19 \u2013 22, 2026<\/p>\n<\/div>

<\/div><\/div>
Venue<\/h6><\/div>

Nangang International Exhibition Center, Hall 2, Taipei,
\nTaiwan
\n> Google Map<\/a><\/p>\n<\/div>

<\/div><\/div><\/div><\/div>
Meet PLANOPTIK at<\/h6><\/div>

Booth number to follow<\/p>\n<\/div>

<\/div><\/div>
Speaker<\/h6><\/div>

Martin Mustermann
\nAbout Advanced Packaging
\nSeptember 10<\/p>\n<\/div>

<\/div><\/div>
Contact<\/h6><\/div>

Jonas Discher
\n+49 2664 5068 21<\/a>
\npackaging@planoptik.com<\/a><\/p>\n<\/div>

<\/div><\/div>
Website<\/h6><\/div>

www.impact.org.tw<\/a><\/p>\n<\/div>

<\/div><\/div>
Organizer<\/h6><\/div>

IMPACT
\nservice@impact.org.tw<\/a><\/p>\n<\/div><\/div><\/div><\/div><\/div><\/div>\n

<\/div><\/div><\/div><\/div><\/div><\/div>

\u2013<\/p>\n<\/div>

\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n

Team up with PLANOPTIK<\/h2><\/div>

\u2013<\/p>\n<\/div>

\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n<\/div><\/div>

\"Team<\/span><\/div><\/div><\/div>
\"Team<\/span><\/div><\/div><\/div>
<\/div><\/div><\/div>

\u2013<\/p>\n<\/div>

\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n

Individually developed<\/h4><\/div>

Are you developing a new microsystem? Are you combining microelectronics, micromecha\u00adnics or microfluidics to create a new product? Are you developing a sensor, an electronic device, a fluidic system or something that has never existed before? Team up with PLANOPTIK.<\/p>\n<\/div><\/div><\/div>

\u2013<\/p>\n<\/div>

\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n

Reliable partnership<\/h4><\/div>

In us you will find a partner who will work with you to develop electronic, mechanical, optical, chemical or biological microcomponents and has a firm grasp of materials such as glass, silicon and copper.<\/p>\n<\/div><\/div><\/div>

\"Team<\/span><\/div><\/div><\/div>

\u2013<\/p>\n<\/div>

\u2013<\/p>\n<\/div><\/div><\/div><\/div>\n

Together until production<\/h4><\/div>

PLANOPTIK also manufactures the jointly deve\u00adloped microcomponents and elements in high volumes using state-of-the-art wafer-based manufacturing processes.<\/p>\n<\/div><\/div><\/div><\/div><\/div>\n<\/p>\n","protected":false},"excerpt":{"rendered":"","protected":false},"author":1,"featured_media":0,"parent":1900,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"100-width.php","meta":{"footnotes":""},"class_list":["post-6533","page","type-page","status-publish","hentry"],"yoast_head":"\nPLANOPTIK AG | EVENTS<\/title>\n<meta name=\"description\" content=\"Discover your career opportunity at PLANOPTIK AG. 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