{"id":1897,"date":"2026-03-08T14:32:53","date_gmt":"2026-03-08T13:32:53","guid":{"rendered":"https:\/\/planoptik.eu\/planoptik-ag-technologies\/"},"modified":"2026-10-18T17:37:23","modified_gmt":"2026-10-18T15:37:23","slug":"technologies","status":"publish","type":"page","link":"https:\/\/www.planoptik.com\/en\/technologies\/","title":{"rendered":"PLANOPTIK AG | TECHNOLOGIES"},"content":{"rendered":"

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Technologies<\/h1><\/div>

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Technologies for functional glass wafers and microsystems<\/h3><\/div><\/div><\/div>

PLANOPTIK combines a broad range of wafer- and panel-level technolo\u00adgies for the development and series production of high-precision glass-based components.<\/p>\n

Our capabilities go far beyond the manufacture of precision substrates. We structure glass, create electrical and functional layers, combine different materials by bonding and integrate multiple process steps into complete manufacturing sequences.<\/p>\n<\/div><\/div><\/div>

This allows us to turn glass, quartz and silicon substrates into functional components for semiconductor packaging, MEMS, microfluidics and other microsystem applications.<\/p>\n<\/div><\/div><\/div><\/div><\/div>

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Independent material selection<\/h1><\/div>

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PLANOPTIK is independent of the major glass manufacturers. This allows us to select the material that best meets the technical requirements of each individual application, without being tied to a specific manufacturer or material portfolio.<\/p>\n

Depending on the application, we process technical and optical glasses, high-purity fused silica and other suitable materials from leading manu\u00adfacturers in the USA, Europe and Asia.<\/p>\n<\/div><\/div><\/div>

In addition, we keep a broad range of commonly used materials in stock, in some cases in significant quantities. This allows us to start production quickly and reduces lead times for many standard materials.<\/p>\n

Our material independence, combined with a well-stocked material inven\u00adtory, enables us to select the most suitable material for each appli\u00adcation while maintaining a high degree of flexibility and short response times.<\/p>\n<\/div><\/div><\/div><\/div><\/div>

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Micro structuring & patterning<\/h1><\/div>

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Creating functional structures in glass<\/h3><\/div><\/div><\/div>

Micro structuring is one of PLANOPTIK\u2019s key technologies. Depending on feature size, geometry, depth, sidewall profile and surface requirements, we use different structuring processes and select the technology best suited to the respective application.<\/p>\n

Our capabilities include:<\/p>\n<\/div>

\u2013 CHEMICAL(WET) ETCHING
\n\u2013 LASER PROCESSING
\n\u2013 SELECTIVE LASER INDUCED ETCHING (SLE)
\n\u2013 DEEP REACTIVE ION ETCHING
\n\u2013 SANDBLASTING<\/p>\n<\/div><\/div><\/div>

Typical structures include:<\/p>\n<\/div><\/div><\/div>

\"Through-Glass<\/span><\/div>

Through-Glass VIAS<\/p>\n<\/div><\/div><\/div>

\"Blind<\/span><\/div>

Blind holes<\/p>\n<\/div><\/div><\/div>

\"Cavities\"<\/span><\/div>

Cavities<\/p>\n<\/div><\/div><\/div>

\"Channels\"<\/span><\/div>

Channels<\/p>\n<\/div><\/div><\/div>

\"Microfluidic<\/span><\/div>

Microfluidic structures<\/p>\n<\/div><\/div><\/div>

<\/div><\/div><\/div>
\"Markings\"<\/span><\/div>

Markings<\/p>\n<\/div><\/div><\/div>

\"Customer-specific<\/span><\/div>

Customer-specific Patterns<\/p>\n<\/div><\/div><\/div><\/div><\/div>

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Shaping<\/h1><\/div>

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Transforming glass into wafers and panels<\/h3><\/div><\/div><\/div>
\"Shaping\"<\/span><\/div><\/div><\/div>

The production of wafers and panels begins with the raw material. Using precise processes, the material is cut into wafers or panels with various geometries. These processes include for example:<\/p>\n<\/div>

\u2013 DIAMOND CUTTING
\n\u2013 WATER-JET CUTTING
\n\u2013 WIRE SAWING
\n\u2013 EDGE GRINDING<\/p>\n<\/div><\/div><\/div><\/div><\/div>

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Surface Treatment and Finishing<\/h1><\/div>

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From substrates to products with high-precision surfaces<\/h3><\/div><\/div><\/div>

Next, various steps are taken to achieve the quality and dimensional accuracy specified by the customer. Therefore, the following processes could be used:<\/p>\n<\/div>

\u2013 GRINDING
\n\u2013 POLISHING<\/p>\n<\/div>

– Regular Polishing
\n– MDF polishing<\/p>\n<\/div>

Our processes enable us to achieve high quality surfaces with<\/p>\n<\/div>

    \n
  • Thickness down to 200 \u03bcm<\/li>\n
  • TTV from 1 \u00b5m (depending on wafer thickness and diameter)<\/li>\n
  • Surface roughness down \u2264 0.5 nm (Ra)<\/li>\n<\/ul>\n<\/div><\/div><\/div>
    \"MDF<\/span><\/div>

    Our MDF polishing process allows a clean etching process<\/p>\n<\/div><\/div><\/div><\/div><\/div>

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    Further Processing<\/h1><\/div>

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    <\/div>
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    Enabling functionality through advanced process steps<\/h3><\/div>

    Following the structuring process, additional manufacturing steps are often required to transform the substrate into a fully functional component. Depending on the application, these processes may include metallization for electrical conductivity, coating to enhance optical, mechanical, or chemical properties, bonding for the integration of multiple materials or components, and dicing for the separation of individual devices.<\/p>\n

    The selection and combination of these processes are tailored to the specific product requirements, ensuring optimal functionality, reliability, and performance in demanding high-tech applications.<\/p>\n<\/div><\/div><\/div><\/div><\/div><\/div>

    \"Glass<\/span><\/div><\/div><\/div><\/div><\/div>

    Metallisation<\/p>\n

    Full-Surface copper metallization
    \nby cu-liner strategy<\/p>\n<\/div>

      \n
    • Substrate material: Borofloat33, quartz<\/li>\n
    • Wafer Diameter: up to 300 mm<\/li>\n
    • Panel Dimension: up to 300 x 300 mm<\/li>\n
    • Panel Dimension: up to 300 x 300 mm<\/li>\n
    • Substrate thickness: 300 \u2013 1000 \u03bcm<\/li>\n
    • Hole diameter: \u226575 \u03bcm<\/li>\n
    • Pitch: twice hole diameter<\/li>\n
    • Cu thickness: 2..10 \u03bcm<\/li>\n<\/ul>\n<\/div>

      Redistribution layer<\/p>\n<\/div>

        \n
      • Customized RDL up to 200 mm diameter<\/li>\n
      • Line \/ Space: 50 \u00b5m \/ 50 \u00b5m<\/li>\n<\/ul>\n<\/div><\/div><\/div>
        \"Metallisation\"<\/span><\/div><\/div><\/div><\/div><\/div>
        \"Lithography\"<\/span><\/div>

        Lithography<\/p>\n<\/div>

          \n
        • Dry resist<\/li>\n
        • Solder Mask<\/li>\n<\/ul>\n<\/div><\/div><\/div>
          \"Various<\/span><\/div>

          Various Coatings<\/p>\n<\/div>

            \n
          • ITO<\/li>\n
          • Titanium<\/li>\n
          • Copper<\/li>\n
          • Alu<\/li>\n
          • Chrome<\/li>\n<\/ul>\n<\/div><\/div><\/div>
            \"Bonding\"<\/span><\/div>

            Bonding<\/p>\n<\/div><\/div><\/div>

            \"Dicing\"<\/span><\/div>

            Dicing<\/p>\n<\/div><\/div><\/div>

            \"Lithography\"<\/span><\/div>

            Lithography<\/p>\n<\/div>

              \n
            • Dry resist<\/li>\n
            • Solder Mask<\/li>\n<\/ul>\n<\/div><\/div><\/div>
              \"Various<\/span><\/div>

              Various Coatings<\/p>\n<\/div>

                \n
              • ITO<\/li>\n
              • Titanium<\/li>\n
              • Copper<\/li>\n
              • Alu<\/li>\n
              • Chrome<\/li>\n<\/ul>\n<\/div><\/div><\/div><\/div><\/div>

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                Team up with PLANOPTIK<\/h2><\/div>

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                \u2013<\/p>\n<\/div><\/div><\/div><\/div>\n<\/div><\/div>

                \"Team<\/span><\/div><\/div><\/div>
                \"Team<\/span><\/div><\/div><\/div>
                <\/div><\/div><\/div>

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                \u2013<\/p>\n<\/div><\/div><\/div><\/div>\n

                Individually developed<\/h4><\/div>

                Are you developing a new microsystem? Are you combining microelectronics, micromecha\u00adnics or microfluidics to create a new product? Are you developing a sensor, an electronic device, a fluidic system or something that has never existed before? Team up with PLANOPTIK.<\/p>\n<\/div><\/div><\/div>

                \u2013<\/p>\n<\/div>

                \u2013<\/p>\n<\/div><\/div><\/div><\/div>\n

                Reliable partnership<\/h4><\/div>

                In us you will find a partner who will work with you to develop electronic, mechanical, optical, chemical or biological microcomponents and has a firm grasp of materials such as glass, silicon and copper.<\/p>\n<\/div><\/div><\/div>

                \"Team<\/span><\/div><\/div><\/div>

                \u2013<\/p>\n<\/div>

                \u2013<\/p>\n<\/div><\/div><\/div><\/div>\n

                Together until production<\/h4><\/div>

                PLANOPTIK also manufactures the jointly deve\u00adloped microcomponents and elements in high volumes using state-of-the-art wafer-based manufacturing processes.<\/p>\n<\/div><\/div><\/div><\/div><\/div>\n<\/p>\n","protected":false},"excerpt":{"rendered":"","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"100-width.php","meta":{"footnotes":""},"class_list":["post-1897","page","type-page","status-publish","hentry"],"yoast_head":"\nPLANOPTIK AG | TECHNOLOGIES<\/title>\n<meta name=\"description\" content=\"Let's talk about PLANOPTIK's wide range of technologies for developing and manufacturing a variety of products at wafer and panel level.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.planoptik.com\/en\/technologies\/\" \/>\n<meta property=\"og:locale\" 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