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Carrier wafers for TSV

Plan Optik AG extends it's activities in respect to glass carrier wafers for semiconductor processes such as TSV thinning.

For the processing of thin Si or GaAs wafers rigid carriers are needed - for example in TSV processes on thin Si wafers. Since the accuracy of the resulting device wafer is influenced by the accuracy of the used carriers the demand on ultra low TTV carriers is increasing.

These carriers need to fulfill various requirements such as mechanical robustness, high temperature and chemical resistance.

Glass is the perfect material for carriers because of it's thermal stability and resistance against acids and other chemicals. Bonding to and de-bonding from a glass carrier can be monitored since glass is transparent. Furthermore glass carriers can be cleaned and re-used which makes a contribution to cost down and environmental protection.

Plan Optik's glass carriers are ground or polished to a very high accuracy by using the latest grinding and polishing technology. A total thickness variation (TTV) as low as 2 μm and a guaranteed thickness tolerance of down to ±3 μm over all carriers in the end leads to accurate semiconductor wafers.

Plan Optik's carrier wafers are clean room packed and ready for immediate use. They are coming either blank or with though holes for easier chemical release or with cavities which allow a better distribution of bond media.

The use of different glass types for these carriers allows an adaption of the coefficient of thermal expansion (CTE) of the carrier to the semiconductor wafer which has to be processed (e.g. Si or GaAs). This reduces or mostly even eliminates stress issues when heat is involved in the used semiconductor processes. For silicon wafers alkaline free types are available.

Different types of intermediate materials, e.g. thermo-plast adhesives, waxes, resists or tapes require different technologies to apply the semiconductor wafers to the carrier wafer.

Plan Optik is producing such low TTV carrier wafers for either the 3M® Wafer Support System as well as the EVG® Temporary Bonding System but also for proprietary developments using unique bonding and de-bonding processes.

Glass carrier wafers are available for semiconductor wafers up to a diameter of 300 mm. The lowest available carrier thickness is 100 μm.

The product group semiconductor carrier wafers (e.g. for TSV) completes the wide spectrum of MEMS packaging wafers from glass, fused silica and glas-silicon-compounds from Plan Optik AG - a public company from Germany having experience in glass processing since more than 40 years.

Plan Optik's products are well established in the MEMS and semiconductor industry for automotive, medical and other industries.

Plan Optik's wafers and carriers are produced according to ISO TS 16949, ISO 14001 and ISO 9001 certifications which ensure the highest quality.

Yole Développement: Carrier wafers for TSV (pdf 127 KB)