{"id":8073,"date":"2026-10-08T19:18:05","date_gmt":"2026-10-08T17:18:05","guid":{"rendered":"https:\/\/www.planoptik.com\/?p=8073"},"modified":"2026-10-29T15:24:36","modified_gmt":"2026-10-29T14:24:36","slug":"device-packaging-2027","status":"publish","type":"post","link":"https:\/\/www.planoptik.com\/de\/device-packaging-2027\/","title":{"rendered":"Device Packaging"},"content":{"rendered":"

Advanced Glass Substrates Event<\/p>\n<\/div><\/div><\/div>

Device Packaging<\/h2><\/div>

Konferenz<\/h4><\/div>

Besuchen Sie uns auf der IMAPS Device Packaging 2027 in Phoenix! Die IMAPS Device Packaging z\u00e4hlt zu den f\u00fchrenden Fachkonferenzen f\u00fcr innovative Halbleiter-Packaging-Technologien. Wir pr\u00e4sentieren auf der Kon\u00adferenz hochpr\u00e4zise Glaswafer und Glaspanels f\u00fcr an\u00adspruchs\u00advolle Anwendungen im Advanced Packaging und Wafer-Level Packaging (WLP). Unsere Glassubstrate er\u00f6ff­nen vielf\u00e4ltige M\u00f6glichkeiten f\u00fcr Packaging-Kon\u00adzep\u00adte der n\u00e4chsten Generation und unterst\u00fctzen die stei\u00adgen\u00adden Anforderungen an die Halbleiterintegration sowie die Fertigung hochintegrierter mikroelektronischer Bauele\u00admente. Wir freuen uns auf den fachlichen Aus\u00adtausch mit Ihnen in Phoenix und darauf, gemeinsam innovative Einsatzm\u00f6glichkeiten unserer Glasl\u00f6sungen f\u00fcr Ihre Packaging-Projekte zu diskutieren!<\/p>\n

Produkte im Fokus
\n> Glass Core Substrates f\u00fcr Advanced Packaging<\/a>
\n> Wafer f\u00fcr Wafer-Level Packaging<\/a><\/p>\n<\/div><\/div><\/div>

\"Device<\/a><\/span><\/div>
<\/div>
<\/div>
Datum<\/h6><\/div>

01. – 04. M\u00e4rz 2027<\/p>\n<\/div>

<\/div><\/div>
Veranstaltungsort<\/h6><\/div>

Sheraton Grand at Wild Horse Pass, Phoenix, Arizona
\nUSA
\n> Google Map<\/a><\/p>\n<\/div>

<\/div><\/div><\/div><\/div>
Besuchen Sie PLANOPTIK am<\/h6><\/div>

Standnummer folgt<\/p>\n<\/div>

<\/div><\/div>
Kontakt<\/h6><\/div>

Jonas Discher
\n+49 2664 5068 21<\/a>
\npackaging@planoptik.com<\/a><\/p>\n<\/div>

<\/div><\/div>
Webseite<\/h6><\/div>

www.imaps.org<\/a><\/p>\n<\/div>

<\/div><\/div>
Veranstalter<\/h6><\/div>

IMAPS<\/p>\n<\/div><\/div><\/div><\/div><\/div><\/div>\n","protected":false},"excerpt":{"rendered":"","protected":false},"author":1,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[67,90,93],"tags":[],"class_list":["post-8073","post","type-post","status-publish","format-standard","hentry","category-events-de","category-glass-core-substrates-de","category-wafer-level-packaging-de"],"yoast_head":"\nDevice Packaging - PLANOPTIK AG<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.planoptik.com\/de\/device-packaging-2027\/\" \/>\n<meta property=\"og:locale\" content=\"de_DE\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Device Packaging\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.planoptik.com\/de\/device-packaging-2027\/\" \/>\n<meta property=\"og:site_name\" content=\"PLANOPTIK AG\" \/>\n<meta property=\"article:publisher\" content=\"https:\/\/www.facebook.com\/Plan.Optik.AG\/\" \/>\n<meta property=\"article:published_time\" content=\"2026-10-08T17:18:05+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2026-10-29T14:24:36+00:00\" \/>\n<meta name=\"author\" content=\"wenjuan_li\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Verfasst von\" \/>\n\t<meta name=\"twitter:data1\" content=\"wenjuan_li\" \/>\n\t<meta name=\"twitter:label2\" content=\"Gesch\u00e4tzte Lesezeit\" \/>\n\t<meta name=\"twitter:data2\" content=\"1\u00a0Minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.planoptik.com\\\/de\\\/device-packaging-2027\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.planoptik.com\\\/de\\\/device-packaging-2027\\\/\"},\"author\":{\"name\":\"wenjuan_li\",\"@id\":\"https:\\\/\\\/www.planoptik.com\\\/en\\\/#\\\/schema\\\/person\\\/a37212178a91fff71d04b00a73580346\"},\"headline\":\"Device Packaging\",\"datePublished\":\"2026-10-08T17:18:05+00:00\",\"dateModified\":\"2026-10-29T14:24:36+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.planoptik.com\\\/de\\\/device-packaging-2027\\\/\"},\"wordCount\":7512,\"commentCount\":0,\"publisher\":{\"@id\":\"https:\\\/\\\/www.planoptik.com\\\/en\\\/#organization\"},\"articleSection\":[\"Events (DE)\",\"Glass Core Substrates (DE)\",\"Wafer-Level Packaging (DE)\"],\"inLanguage\":\"de\",\"potentialAction\":[{\"@type\":\"CommentAction\",\"name\":\"Comment\",\"target\":[\"https:\\\/\\\/www.planoptik.com\\\/de\\\/device-packaging-2027\\\/#respond\"]}]},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.planoptik.com\\\/de\\\/device-packaging-2027\\\/\",\"url\":\"https:\\\/\\\/www.planoptik.com\\\/de\\\/device-packaging-2027\\\/\",\"name\":\"Device Packaging - 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