Plan Optik AG
	STRUCTURED WAFERS Wafers Basic Material: please refer to Glass- and Quartzwafers. Technology Ultra Sonic Drilling. USHD (Ultra Sonic High Speed Drilling). Powder Blasting. Etching.   READ MORE Holes Round and rectangular through holes. Very small location tolerances. High centricity. Channels Minimum channel width: 50 microns. Channel depth and distance not limited. Cavities Variable surface quality of cavity bottom surface (including optical quality). Contact Carsten Wesselkamp Email: c.wesselkamp@planoptik.com Tel: +49 2664 5068 25 Fax: +49 2664 5068 91     BACK