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15.01.2010 Micro Fluidic Substrates Plan Optik AG, the world market leader in glass wafer production for MEMS applications, offers the following micro fluidic substrates:
Bonding of structured substrates by direct, adhesive and anodic bonding is available up to a size of 200 mm. All wafers produced by Plan Optik are characterized by low ttv, thickness tolerance, low roughness and high surface quality. Plan Optik set the benchmark regarding perfect glass wafer surfaces by introducing it's proprietary development MDF polishing to the market. MDF (Micro Damaging Free) polished wafers are suitable for wet etching processes and avoid the well known issue sub surface damaging which can lead to defects. Sub surface damaging leads to small cavities and interconnections between the etched structures, weakens the bonding interface and results in a low yield. The use of MDF polished wafers leads to reliable wet etching results and provides a high wafer processing yield. MDF polished wafers are available as blank wafers as well as including holes and cavities. Such wafers are already implemented in a drug delivery system as well as many gen analysis products. Plan Optik's subsidiary "Little Things Factory" in Ilmenau additionally offers complex OEM sub systems for micro reaction technology as well as micro fluidics. The above micro fluidic substrates complete the wide spectrum of glass and fused silica wafer options produced by the Plan Optik group - a well-established German company that has gone public with great success in the end of 2005. Plan Optik's ISO TS 16949, ISO 14001 and ISO 9001 certifications ensure the best available substrate quality in the world. 14.12.2009 Plan Optik invests in capacity and new technologies Plan Optik AG, the biggest glass and glass-silicon compound wafer producer world wide has announced to increase production capacity significantly within the coming 6 months. Plan Optik is reacting to the rapidly increasing demand for MEMS substrates from Q3 2009 – mainly for sophisticated glass-silicon compound substrates for wafer level packaging of optical MEMS (MOEMS) such as CMOS image sensors, projection technology and LED applications as well as carrier substrates for semiconductor wafer handling and processing.  Plan Optik has already started to add about 50% production space which will be available from Q2 2010. The demand on Plan Optik’s products is already back on the same high level as 2 years ago and the forecasted demands for 2010 accelerate this fast capacity increase of today. This expansion includes investments in latest grinding, CMP and anodic bonding equipment and not least automation of existing processes. Plan Optik produces cap wafers from glass as well as glass silicon compound wafers which can be directly bonded to device wafers in various ways (mainly anodic and adhesive bonding).  Core processes used by Plan Optik are grinding, polishing (CMP), (ultra sonic) drilling, sand blasting, wet etching and bonding glass and glass-silicon compound substrates. Materials used are borosilicate and alkaline free glass as well as silicon and silica.  Combining the big variety of processing techniques, Plan Optik also offers cap wafers with optical (transparent) cavities, through holes for conductive connection as well as high accuracy blank glass substrates for best available performance. These wafers are clean room suitable and are already implemented in many high end image sensor applications. All wafers produced by Plan Optik are characterized by low ttv, thickness tolerance, low roughness and high surface quality. Plan Optik set the benchmark in respect to virtually perfect glass wafer surfaces by introducing it's proprietary development MDF polishing to the market. MDF (Micro Damaging Free) polished wafers are suitable for wet etching processes and avoid the well known issue sub surface damaging which can lead to defects. Sub surface damaging leads to small cavities and interconnections between the etched structures, weakens the bonding interface and results in a low yield. The use of MDF polished wafers leads to reliable wet etching results and provides a high wafer processing yield. Plan Optik, a public company located in Germany produces polished wafers for MEMS applications such as tire pressure monitoring systems and drug dispensing solutions since almost 20 years. Plan Optik's ISO TS 16949, ISO 14001 and ISO 9001 certifications ensure the quality all substrates are produced to. 24.03.2009 Plan Optik AG: Now certified to TS 16949 Elsoff. Plan Optik AG is now certified according to the Technical Specification TS 16949. This is an internationally recognised quality standard established within the automotive industry and is of special importance to all suppliers in this industry segment. This quality standard aims to optimise the management system and supply chain. This is detailed in steps for the prevention or early discovery of faults and risks in the production processes and supply system. To establish the reasons for these problems and to design and implement remedies. TS 16949 emphasises the prevention of failures against the correction of problems evolving from poor design or management systems. In this respect the TS 16949 exceeds the quality standards like VDA 6.1 or QS-9000. Plan Optik AG is now highly certified and is a recognised OEM supplier. As part of this standard the audit proofed the purchasing of the correct raw materials to the approved specifications and delivery within the specified delivery schedules. |
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