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15.02.2011
Carrier wafers for TSV
Plan Optik AG extends it's activities in respect to glass carrier wafers for semiconductor processes such as TSV thinning. For the processing of thin Si or GaAs wafers rigid carriers are needed - for example in TSV processes on thin Si wafers.
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27.12.2010
Plan Optik takes over a majority share in MMT
Plan Optik has acquired a majority share in MMT Micro Mechatronic Technologies GmbH, based in Siegen. The takeover took place within the framework of an asset deal. After completion of the transaction Plan Optik will hold 70% of the shares in the company.
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27.10.2010
Plan Optik opens new 200 mm MEMS cap wafer line
Plan Optik AG, the major manufacturer of cap wafers for wafer level packaging has recently opened it's new 200 mm cap wafer fab in Germany.
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25.10.2010
Plan Optik adds high power LED cap wafers up to 200 mm to it's product portfolio
Plan Optik AG, the leading Cap wafer producer for wafer level packaging applications has launched it's fully equipped 200 mm cap wafer production line for LED packaging wafers recently. (pdf 192 KB)
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15.01.2010
Micro Fluidic Substrates
Plan Optik AG offers micro fluidic substrates and uses all available processing methods for the structuring of wafers such as sand (powder) blasting, wet etching, ultra sonic drilling and a patented moulding process.
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