Quartz wafers off the shelf

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Quartz wafers off the shelf



In urgent need of quartz wafers?

You order - we ship off the shelf (subject to availability and prior sales).

Minimum order quantity: just 10 pieces.

Made from amorphous silicon dioxide of high purity. It provides a very good transmission in the near UV, VIS and IR wavelength region. The thermal expansion as well as the OH content is very low which makes them suitable for almost all application in near UV, VIS and IR - especially for high temperature applications. Wafers from this material are virtually bubble and fluorescence free.


Material Amorphous quartz glass (SiO2)
Main features alkaline free
low fluorescence
low OH content
high temperature resistance
Thermal Data  
Softening temperature
Annealing temperature
Strain temperature
Max. working temperature (continuous)
Max. working temperature (short term)
1710 °C
1220 °C
1125 °C
1160 °C
1300 °C
Heat Conductivity
(W/(m K))
20 °C: 1.38
100 °C: 1.47
200 °C: 1.55
300 °C: 1.67
400 °C: 1.84
950 °C: 2.68
Coefficient of thermal expansion (cte)
(10-6 K-1)
0..100 °C: 0.51
0..200 °C: 0.58
0..300 °C: 0.59
0..600 °C: 0.54
0..900 °C: 0.48
-50..0 °C: 0.27
Specific heat
(J/(kg K))
0..100 °C: 772
0..500 °C: 964
0..900 °C: 1052
Mechanical data  
Density (kg/m3)
Mohs hardness
Knoop (N/mm2)
Modulus of elasticity (20 °C; MPa)
Poisson's ratio

2203
5.5..6.5
5800..6100
72500
0.17
Electrical data  
Electrical resistivity
(Ω cm)
20 °C: 1.0 x 1018
400 °C: 1.0 x 1010
800 °C: 6.3 x 106
1200 °C: 1.3 x 105
Dielectric strength
(KV/mm; sample thickness ≥ 5 mm)
20 °C: 25..40
500 °C: 4..5
Dielectric loss angle (tg δ) 1 KHz: 5.0 x 10-4
1 MHz: 1.0 x 10-4
3 x 1010 Hz: 4.0 x 10-4
Dielectric constant (ε) 20 °C; 0..106 Hz: 3.70
23 °C; 9x108 Hz: 3.77
23 °C; 3x1010 Hz: 3.81

Chemical Data
Trace elements (ppm)

Al Ca Cr Cu Fe K Li Mg Mn Na Ti Zr OH
15 0,5 < 0.05 < 0.05 0.1 0.4 0.6 0.05 < 0.05 0.3 1.1 0.7 < 30


Optical Data  
Transmission
(typical; 1 mm thick sample; including Fresnel reflection losses)
200 nm: 75%
250 nm: 87%
300..3500 nm: 92%

Wafer surface processing double side polished, scratch-dig 20-10 according to MIL-PRF-13830
Surface roughness average roughness (Ra) < 0.5 nm
Wafer edge according to SEMI M1
Edge exclusion zone 6 mm
Packing cleanroom packed

Available types

Article number Diameter (mm) Thickness (μm) ttv (μm) SEMI index
V015.04-1104 100.0 ±0.3 200 ± 10 < 10 32.5 mm
V015.04-1105 100.0 ±0.3 300 ± 10 < 10 32.5 mm
V015.04-1107 100.0 ±0.3 525 ± 10 < 10 32.5 mm
V015.04-1109 100.0 ±0.3 675 ± 10 < 10 32.5 mm
V015.04-1111 100.0 ±0.3 1000 ± 10 < 10 32.5 mm
V015.06-1104 150.0 ±0.3 200 ± 10 < 10 57.5 mm
V015.06-1105 150.0 ±0.3 300 ± 10 < 10 57.5 mm
V015.06-1107 150.0 ±0.3 525 ± 10 < 10 57.5 mm
V015.06-1109 150.0 ±0.3 675 ± 10 < 10 57.5 mm
V015.06-1111 150.0 ±0.3 1000 ± 10 < 10 57.5 mm
V015.08-1105 200.0 ±0.3 300 ± 10 < 10 Notch
V015.08-1107 200.0 ±0.3 525 ± 10 < 10 Notch
V015.08-1109 200.0 ±0.3 675 ± 10 < 10 Notch
V015.08-1111 200.0 ±0.3 1000 ± 10 < 10 Notch

Besides above wafers which are available off the shelf, Plan Optik produces customized wafers according to customer's specification (different material properties, thickness, diameter, flats, notches, etc.).



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