Micro lenses

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Bonding technologies



Plan Optik micro lenses can be fitted with spacers or interposers using an innovative bonding process.

By means of the spacers or interposers lens packages consisting of lenses of widely differing geometry can be created.


Micro lenses
Micro lens bonded to spacer
Micro lenses
Lens stack consisting of
2 lens wafers and 2 spacers


Plan Optik uses the following technologies for the bonding process:


Anodic bonding


For bonding lens wafers with silicon. Permanent, temperature-resistant and hermetic bonding without the use of auxiliary materials.


Direct bonding


For bonding lens wafers with silicon. Permanent, temperature-resistant and hermetic bonding without the use of auxiliary materials.


Adhesive processes


For bonding lens wafers using spacers made of various materials (glass or silicon) by using application-specific optimized media for permanent and reversible bonding.