Carrier wafers

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Plan Optik produces carrier wafers for the processing of semiconductor wafers with diameters of 2" - 300 mm. The carriers are available in thicknesses from 100 µm. The precise specification of each wafer is determined in agreement with the customer, depending on the intended application. The diameter of the carrier can include intermediate dimensions, such as, for example, 155 mm for the processing of wafers measuring 150 mm.

Diameter 50 - 305 mm
Thickness range 100 µm - 20 mm
Thickness tolerance from +/- 5 µm
Total thickness variation (ttv) from 2 µm
Edge geometry incl. flat(s) + notch In accordance with SEMI for monocrystalline Si wafers
or according to customer requirements (e.g. without flat / notch)

The use of the latest production technology at Plan Optik guarantees the maintenance of minimal thickness tolerance and total thickness variation (ttv).

The use of contact-free optical surface measurement techniques ensures the reliable adherence to the predetermined narrow tolerances.