Glass on silicon / silicon on glass wafers

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Surfaces



Plan Optik offers GOS / SOG wafers with either ground or polished surfaces as required. The surface texture can be selected depending on the intended application (anodic bonding, direct bonding, etching, need for hydrophobic or hydrophilic surfaces etc.). By means of specially developed polishing techniques such as the MDF (Micro Damage Free) process, Plan Optik wafers can be delivered if required with especially low surface roughness within the Angström range.


MDF polishing


Roughness Ra < 0,5 nm
Material Available for the glass side of the GOS / SOG wafer
Application For direct bonding (fusion bond) and wet etching of the glass side

Standard polishing


Roughness Ra < 1,5 nm
Material Available for both the glass and the silicon side
Application For anodic and eutectic bonding

Ground surfaces



Roughness Ra from 0.1 µm
Material Available for both the glass and the silicon sides
Application For adhesive processes

The combination of the described surfaces within a wafer is possible, as is the production of surfaces in accordance with customer-specific predetermined parameters.