Glass on silicon / silicon on glass wafers

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Plan Optik produces GOS and SOG wafers with diameters of 2" - 200 mm and thicknesses from 250 µm. The precise specification of each wafer is determined in agreement with the customer, depending on the intended application.

Diameter 2" - 200 mm
Thickness range 250 - 2000 µm
Thickness Si and / or glass layer 20 - 1000 µm
Edge geometry incl. flat(s) + notch in accordance with SEMI for monocrystalline Si-wafers
Special bondgap removal

The use of the latest production technology at Plan Optik guarantees the maintenance of minimal thickness tolerance and total thickness variation (ttv).