Substrate wafers for general semiconductor technology for direct application within the customer product. Glass on silicon or silicon on glass, quartz and alkaline-free wafers for RF applications, customer-specific solutions and special sizes up to 300 mm. Standard wafers are available ex warehouse.
Process carriers for the manufacture of ultra-thin substrates of silicon, gallium arsenide and other special materials. Cte-adapted materials, re-usable, smallest wafer-to-wafer thickness tolerances, various surface characteristics and structuring for all generally available bonding processes. Customer-specific solutions.
Through Glass Vias (TGV)
Hermetically sealed Through Glass Vias (TGV) through the manufacture of feed-throughs in a single production step. Vacuum tight, top operational safety even in difficult environments, for example where there are wide temperature fluctuations. Small packaging size through the adoption of Plan Optik technology.
Fluidic components of various materials for lab-on-chip solutions and micro reactors for chemical and healthcare applications. Low thickness tolerances, MDF polished, suitable for wet etching processes to avoid damage. Suitable for all bond processes. Multilevel version for compact construction.
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