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Plan Optik Group
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Packaging wafers
Substrate wafers
Carrier wafers
Conductive via wafers
Micro lenses
Fluidics components
Optics
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Packaging wafers
Cap wafers for wafer level packaging up to 300 mm available in various materials and combinations. Applications in consumer electronics, automotive, aerospace, chemistry, pharmaceuticals and semiconductors such as, for example, CMOS encapsulation or tire pressure sensors.
Substrate wafers
Substrate wafers for general semiconductor technology for direct application within the customer product. Glass on silicon or silicon on glass, quartz and alkaline-free wafers for RF applications, customer-specific solutions and special sizes up to 300 mm. Standard wafers are available ex warehouse.
Carrier wafers
Process carriers for the manufacture of ultra-thin substrates of silicon, gallium arsenide and other special materials. Cte-adapted materials, re-usable, smallest wafer-to-wafer thickness tolerances, various surface characteristics and structuring for all generally available bonding processes. Customer-specific solutions.
Conductive via wafers
Hermetically sealed Conductive via wafers through the manufacture of feed-throughs in a single production step. Vacuum tight, top operational safety even in difficult environments, for example where there are wide temperature fluctuations. Small packaging size through the adoption of Plan Optik technology.
Micro lenses
Micro lenses made of glass on wafer level for the development of optical MEMS, optical storage systems and other optical applications. Improved quality at the same size; single lenses and arrays. Lens surface with low roughness below 1 nanometer, simple reproducibility.
Fluidics components
Fluidics components of various materials for lab-on-chip solutions and micro reactors for chemical and healthcare applications. Low thickness tolerances, MDF polished, suitable for wet etching processes to avoid damage. Suitable for all bond processes. Multilevel version for compact construction.
Optics
Mirrors with optimized metallic coating up to 1800 mm. Substrate for scales for the linear positioning of 3D measuring machines and CNC systems made of glass ceramics or standard glass up to 3500 mm. Machining tables and optical benches with vacuum grooves and drillings. UV exposure optics.
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