Packaging wafers

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Surfaces



Plan Optik supplies packaging wafers with either ground or polished surfaces as required. The surface texture can be selected according to the intended application (anodic bonding, direct bonding, wet etching, the need for hydrophobic or hydrophilic surfaces etc.). Special polishing techniques like Plan Optik's specially developed MDF (Micro Damage Free) process means that Plan Optik wafers can be supplied with especially low surface roughness within the Angström range if required.


MDF polishing


Roughness Ra < 0.5 nm
Material available for all materials in general use
Application for direct bonding (fusion bond) and wet etching

Standard polishing


Roughness Ra < 1.5 nm
Material available for all materials in general use
Application for anodic and eutectic bonding; optical cap wafers

Ground surfaces



Roughness Ra from 0.1 µm
Material available for all materials in general use
Application for adhesive processes

The combination of the surfaces described within a wafer is possible, as is the production of surfaces in accordance with customer-specific predetermined parameters.