Packaging wafers

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Plan Optik produces packaging wafers with diameters from 2" to 300 mm and thicknesses from 100 - 3000 µm. The precise specification of each wafer is determined in agreement with the customer, depending on the intended application.

Diameter 2" - 300 mm
Thickness range 100 - 3000 µm
Edge geometry incl. flat(s) + notch in accordance with SEMI for monocrystalline Si-wafers

The use of the latest production technology at Plan Optik guarantees compliance with the minimal thickness tolerance and total thickness variation (ttv).