Packaging wafers

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Bonding technologies



Packaging wafers by Plan Optik which are manufactured from material combinations are produced specially according to the proposed application using suitable bonding processes.


Anodic bonding


For bonding borosilicate glass with silicon. Permanent, temperature-resistant and hermetic bonding without the use of auxiliary materials.


Direct bonding


For bonding different types of glass with each other and with silicon. Permanent, temperature-resistant and hermetic bonding without the use of auxiliary materials.


Adhesive processes


For bonding wafers of all materials using application-specific optimized media for permanent as well as reversible bonding.


Eutectic bonding


For bonding wafers of all materials using metallic alloys such as, for example, titanium-gold.