Plan Optik manufactures micro lenses on the basis of wafers by means of a patented glass reflow process which makes it possible to produce convex and concave, spherical and cylindrical glass lens structures. Plan Optik supplies these micro lenses as complete wafers for encapsulating MOEMS (Micro-opto-electromechanical systems); alternatively, by employing a high-precision cutting process, they can also be produced singly as individual lenses or arrays.
The material used is borosilicate glass whose expansion coefficient has been adapted to that of silicon. This permits the processing of lens wafers using anodic bonding with micro structured silicon wafers, for example for the construction of image sensors. In contrast to the polymer lenses traditionally used in this field, glass lenses demonstrate a considerably higher resistance to high temperatures and humidity. For this reason the use of Plan Optik lens wafers permits the carrying out of manufacturing processes frequently employed in the semiconductor industry, such as the soldering of contacts, without destroying the lenses.