Fluidic components

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Bonding technologies



Fluidic components by Plan Optik which are manufactured from material combinations are specially produced according to the intended application using suitable bonding processes.


Anodic bonding


For bonding borosilicate glass with silicon. Permanent, temperature-resistant and hermetic bonding without the use of auxiliary materials.


Direct bonding


For bonding different types of glass with each other and with silicon. Permanent, temperature-resistant and hermetic bonding without the use of auxiliary materials.


Adhesive processes


For bonding wafers of all materials using application-specific optimized media for permanent and reversible bonding.


Eutectic bonding


For bonding wafers of all materials using metallic alloys such as, for example, titanium-gold.