Through Glass Vias (TGV)

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Plan Optik supplies TGV optionally with ground or polished surfaces. The texture of the surface can be selected to suit the application in question.

Standard polishing

Roughness Ra < 1.5 nm

Ground surfaces

Roughness Ra from 0.1 µm

The combination of the described surfaces within a wafer is possible, as is the production of surfaces in accordance with customer-specific predetermined parameters.

Depending on the intended application the silicon or glass surface within the conductive via wafer can be produced as either recessed or raised.