Through Glass Vias (TGV)

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Structuring



Plan Optik produces TGV in accordance with customer-specific agreed layouts. Surfaces within the wafer can be filled with glass or silicon in an almost endless variety of ways. The basic rule is: the larger the ratio of silicon, the less expensive the manufacture of this conductive via wafer will be.

The minimum possible size of the structuring as regards glass and silicon areas depends on the thickness of the wafer and starts at about 50 µm.

In general the following different types of execution are commonly used:

Through Glass Vias (TGV)