Carrier wafers

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Surfaces



Plan Optik supplies carrier wafers either with ground or polished surfaces as required. The texture of the surface can be chosen to suit the intended application. For example, ground surfaces (roughness from 80 nm) permit a more even distribution of the bonding media used for mounting the semiconductor wafers.


Standard polishing


Roughness Ra < 1,5 nm
Material available for all materials

Ground surfaces



Roughness Ra from 0.1 µm
Material available for all materials

The combination of the described surfaces within a wafer is possible, as is the production of surfaces in accordance with customer-specific predetermined parameters.