Carrier wafers

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Materials



Plan Optik produces carrier wafers using materials whose expansion coefficient is as closely adapted as possible in each case to that of the semiconductor wafer to be processed.*


Carriers for processing Si wafers


Type Borofloat 33 ®
Thickness range 100 µm - 20 mm
Expansion coefficient (CTE) 3.25 x 10-6 K-1 (adjusted to Si)
Refraction index (nD) 1.4713
Main characteristics Expansion coefficient adjusted to Si
Type Eagle XG
Thickness range 100 - 1000 µm
Expansion coefficient (CTE) 3.17 x 10-6 K-1 (adjusted to Si)
Refraction index (nD) 1.5099
Main characteristics Expansion coefficient adjusted to Si,
virtually alkaline-free

Carriers for processing GaAs wafers


Type SCG72
Thickness range 100 - 1000 µm
Expansion coefficient (CTE) 7.2 x 10-6 K-1
Main characteristics Expansion coefficient adjusted to GaAs

Additional materials


Plan Optik produces carrier wafers according to customer requirements from a selection of more than 300 types of glass or combinations thereof (e.g. optical glasses, soda-lime glass). This includes materials with a wide range of characteristics such as, for example, thermal expansion, so that the appropriate material for virtually every application can be selected.



* All technical data in accordance with the details supplied by the manufacturers of the raw materials - without liability - subject to modification.