Customized borosilicate wafers

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Surfaces



Plan Optik offers customized wafers with either ground or polished surfaces. The surface texture can be selected depending on the intended application (anodic bonding, direct bonding, etching, need for hydrophobic or hydrophilic surfaces etc.). By means of specially developed polishing techniques such as the MDF (Micro Damage Free) process, Plan Optik wafers can be delivered if required with especially low surface roughness within the Angström range.


MDF polishing


Roughness Ra < 0.5 nm
Material available for all materials in general use
Application for direct bonding (fusion bond) and wet etching

Standard polishing


Roughness Ra < 1.5 nm
Material available for all materials in general use
Application for anodic and eutectic bonding; optical cap wafers

Ground surfaces



Roughness Ra from 0.1 µm
Material available for all materials in general use
Application for adhesive processes

The combination of the described surfaces within a wafer is possible, as is also the production of surfaces in accordance with customer-specific predetermined parameters.