Customized borosilicate wafers

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Dimensions



Plan Optik produces customized wafers with diameters of 2" - 300 mm and thicknesses from 100 - 3000 µm. The precise specification of each wafer is determined in agreement with the customer depending on the application in question.


Diameter 2" - 300 mm
Thickness range 100 - 3000 µm
Total thickness variation (ttv) from 2 µm
Edge geometry incl. flat(s) + notch in accordance with SEMI for monocrystalline Si-wafers

Plan Optik uses the very latest manufacturing technology, which guarantees adherence to minimal thickness tolerances and total thickness variation (ttv).