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15.07.2013

Plan Optik AG among the top five in the glass wafer sector worldwide
In the glass wafer sector for micro-mechanical applications, Plan Optik AG is in fourth place of the world wide total market for glass wafers. This was the conclusion reached by the research institute Yole Developpement (Lyon) in a wide-ranging study.
15.02.2012

3-D wafer-level packaging enables the miniaturization of rotary rate sensors
In the design and manufacture of pressure, acceleration and gyro sensors a paradigm shift is currently taking place. In future, 3-D wafer-level packaging will represent the definitive technology.
15.02.2011

Carrier wafers for TSV
Plan Optik AG extends it's activities in respect to glass carrier wafers for semiconductor processes such as TSV thinning. For the processing of thin Si or GaAs wafers rigid carriers are needed - for example in TSV processes on thin Si wafers.
27.12.2010

Plan Optik takes over a majority share in MMT
Plan Optik has acquired a majority share in MMT GmbH, based in Siegen. The takeover took place within the framework of an asset deal.
27.10.2010

Plan Optik opens new 200 mm MEMS cap wafer line
Plan Optik AG has recently opened it's new 200 mm cap wafer fab in Germany. The actual expansion of Plan Optik's capacity includes investments in latest grinding, CMP and anodic bonding equipment and not least automation of existing processes.
25.10.2010

Plan Optik adds high power LED cap wafers up to 200 mm to it's product portfolio
Plan Optik AG, the leading Cap wafer producer for wafer level packaging applications has launched it's fully equipped 200 mm cap wafer production line for LED packaging wafers recently. (pdf 192 KB)
15.01.2010

Micro Fluidic Substrates
Plan Optik AG offers micro fluidic substrates and uses all available processing methods for the structuring of wafers such as sand (powder) blasting, wet etching, ultra sonic drilling and a patented moulding process.
14.12.2009

Plan Optik invests in capacity and new technologies
Plan Optik AG, the biggest glass and glass-silicon compound wafer producer world wide has announced to increase production capacity significantly within the coming 6 months.
24.03.2009

Plan Optik AG: Now certified to TS 16949
Plan Optik AG is now certified according to the Technical Specification TS 16949. This is an internationally recognised quality standard established within the automotive industry and is of special importance to all suppliers in this industry segment.
17.10.2008

Plan Optik AG: Production meets highest environmental standards
The environmental management of Plan Optik AG fulfils the very high standards required by the ISO 14001 norm. That is the result of the certification process which has just been successfully completed.
21.07.2008

Plan Optik AG launches 300 mm glass wafer production
The top position in the glass wafer market is nothing new for Plan Optik. It is quite consequent that Plan Optik also sets the standard of the new glass wafer size generation by launching the world's first 300 mm diameter glass wafer production line.
02.05.2008

Glass carriers for semiconductor processes
Plan Optik AG, the world market leader in glass and fused silica wafer production for MEMS applications, now offers glass carriers for semiconductor processes.
July 2007

Micro fluidics in industry
Plan Optik AG, the biggest glass and glass-silicon compound wafer producer world wide has announced to increase production capacity significantly within the coming 6 months.
21.06.2007

Electrical vias in silicon and glass wafers
Plan Optik AG draws on an exceptional technology to combine glass and silicon in multifarious ways in regards to the fabrication of sophisticated substrates for MEMS and optoelectronics applications.
18.06.2007

Innovative Substrates for MEMS
Plan Optik AG offers the following wafer level packaging substrates. All wafers produced by Plan Optik are characterized by low ttv, thickness tolerance, low roughness and high surface quality.
16.10.2006

Electrical feedthrough wafers for waferlevel packaging Conductive vias through silicon and glass wafers
Waferlevel packaging of MEMS devices by using additional cap wafers including cavities and vertical electrical vias is an alternative to integrated encapsulation processes.
17.05.2006

Glass wafers for TPMS
Plan Optik AG, the world market leader in glass and fused silica wafer production for MEMS applications, offers borosilicate glass wafers for anodic bonding which meet the special requirements of safety related automotive applications.
13.04.2006

New Glass wafer production line for large glass wafers
Plan Optik AG, world market leader in glass and fused silica wafer production for MEMS applications announces the completion of a new production line for large glass and fused silica wafers.
09.01.2006

Plan Optik - Going Public
2005 was a successful and eventful year for Plan Optik - the technology leader has doubled its capacity because of a dramatically increasing demand for these products.