Thin wafer handling - Carriers for chemical release
From now on Plan Optik AG offers re-usable carriers for thin wafer handling which can be used for chemical release of device wafers.
Ultra high purity fused silica (UV grade fused silica)
Plan Optik AG the leading manufacturer of glass and quartz wafers now offers fused silica wafers from one of the purest materials: ULTRA HIGH PURITY FUSED SILICA.
Quartz Wafers with extremely low roughness
From now on Plan Optik offers sub nanometer roughness on polished Quartz wafers. These Wafers do have a guaranteed average roughness of less than 0.5 nm whilst in practice the average roughness is well below this value (at about 0.25 nm).
Plan Optik AG implements high accuracy laser patterning technology
Plan Optik AG, the leading manufacturer of glass, quartz and glass-Si compound wafers has added laser patterning to its structuring techniques recently. Glass, quartz (eg fused silica) and silicon can be patterned generating an extremely high accuracy.
Process Carriers for Wafer and Substrate Handling
Plan Optik AG, the leading manufacturer of glass, quartz and glass-Si compound wafers has expanded its production range on carriers for the handling of small semiconductor wafers as well as small substrates for various applications.
Carriers for THIN WAFER HANDLING
Plan Optik AG, the leading manufacturer of glass wafers, has expanded its production on glass and silicon carriers for Thin Wafer Handling of semiconductor wafers.
Borofloat® 33 Wafers now available from stock
Plan Optik AG, the leading manufacturer of glass wafers, expands its production of blank Borofloat® 33 substrate wafers immensely. In response to the high demand of stock wafers, Plan Optik has enlarged its capacity...
Plan Optik AG expands its production of QUARTZ WAFERS significantly
Plan Optik AG is expanding its product range in the rapidly growing segment of quartz wafers significantly. In addition to a comprehensive range of standardized processes for wafers in sizes up to 300 mm diameter, ...
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