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25.10.2018

Carrier Wafer - a useful and necessary tool for MEMS and Sensor Packaging
There is ongoing wafer thickness reduction in the MEMS and semiconductor industry. This is because of market demand for smaller devices that afford an increased number of functionalities at reduced cost; and for this, smaller package sizes need to be realised.
03.05.2018

Plan Optik expands its range of stock wafers
Plan Optik AG expands its range of products which are available off the shelf to feature new materials! Additionally Plan Optik releases a product catalogue including all stock products with detailed information and specification!
21.02.2018

Carriers for mechanical release - Thin Wafer Handling
Plan Optik AG offers re-usable carriers for thin wafer handling which can be used for mechanical release of the device wafers.
25.01.2018

Adapter Carriers - Maximum Flexibility
Plan Optik AG offers Carrier Wafers which enable handling of smaller diameter wafers and a variety of substrates with different dimensions.
02.11.2017

Thin wafers from glass and quartz
Plan Optik AG now offers extremely thin wafers from glass and quartz as thin as 100 microns.
22.08.2017

Substrate und Carrier Wafer für GaAs, GaN, SiC und InP
Plan Optik AG bietet ab sofort Substrate und wiederverwendbare Carrier Wafer für das Dünnwaferhandling von Galliumarsenid- (GaAs), Galliumnitrid- (GaN), Siliziumcarbid- (SiC) und Indiumphosphid- (InP) Wafern.
16.03.2017

Thin wafer handling - Carriers for chemical release
From now on Plan Optik AG offers re-usable carriers for thin wafer handling which can be used for chemical release of device wafers.
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