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16.10.2006
Electrical feedthrough wafers for waferlevel packaging Conductive vias through silicon and glass wafers


Waferlevel packaging of MEMS devices by using additional cap wafers including cavities and vertical electrical vias is an alternative to integrated encapsulation processes and enables the development of new innovative MEMS solutions or simplify the packaging. Plan Optik AG in Germany offers electrical feedthrough wafers with a high density of vias through silicon and glass wafers to achieve compact device dimensions.

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